12 Layers Sinking Gold High Density PCB Customized Design for Electrionic Devices

12 Layers HD PCB Sinking Gold Board:

The High Density PCB is a cutting-edge circuit board specifically designed for demanding applications in the automotive electronics industry. With a superior construction and advanced features, this PCB is ideal for projects that require high performance and reliability.

Key Product Attributes:

• Copper Thickness: The High Density PCB boasts a copper thickness of 2oz on the outer layers and 1oz on the inner layers. This design ensures excellent conductivity and heat dissipation, making it suitable for high-power applications.
• Layer Count: This PCB features 12 layers, allowing for complex circuitry and improved signal integrity. The multiple layers also enable efficient routing of signals and power, reducing electromagnetic interference.
• Thickness: With a thickness of 1.2mm, the High Density PCB strikes the perfect balance between durability and flexibility. This thickness makes it suitable for compact designs while maintaining structural integrity.
• Minimum Via Diameter: The PCB supports a minimum via diameter of 0.2mm, facilitating the implementation of staggered vias for optimized signal routing and signal integrity (SI).
• Surface Finish: The High Density PCB offers multiple surface finish options including HASL, ENIG, OSP. These finishes provide varying levels of solderability, corrosion resistance, and conductivity to meet different project requirements.

Features:

1.Microvias:
• Description: Small vias (typically in diameter) created by laser drilling. They are crucial for connecting layers in a high-density environment.
• Function: Enables high connection density and complex routing in a small area.
2. Blind and Buried Vias:
• Description: Vias that do not pass through the entire board (blind) or only connect internal layers (buried).
• Function: Saves valuable surface space and internal routing area compared to traditional through-holes.
3. Finer Lines and Spaces:
• Description: The trace width and the space between traces are significantly reduced, often to .
• Function: Allows for more traces to be routed in a given area, increasing the density.
4. Higher Component Density:
• Description: Due to the fine pitch features and microvias, more components (especially high pin count devices like BGAs) can be placed and connected on a smaller board footprint.
• Function: Essential for modern portable and high-performance electronic devices (e.g., smartphones, wearables).

FAQ:

1.Q:What kind of circuit board is this product?

A:HDI PCB (High-Density Interconnect PCB) is an advanced circuit board utilizing microvias and fine lines/spaces to achieve a higher wiring and component density. This allows for the miniaturization of electronic devices.

2.Q:How many layers can your circuit boards provide?

A:We typically provide 2-30 layer boards, and in special cases, we can stack more layers.

3. Q:Do your circuit boards support customization?

A:Yes, we support customized designs. You can send us your Gerber files and BOM list, and we will provide you with an accurate quote based on the information and market conditions.

4. Q:What do Gerber files typically contain?

A:Normally Gerber files Include:PCB Types,Product thickness, Ink color, Surface treatment process and If SMT processing is required, component BOM and tag drawing are also required.
5. Q:What is your minimum order quantity for PCB boards?

A:Our minimum order quantity is 1 piece(5 square meters),the larger the quantity, the bigger the discount.

6. Q:Do you have relevant certification certificates to support this?

A:We hold numerous important certifications, including ISO, UL, CE, and RoHS. All products undergo rigorous quality testing.

7. Q:What payment method do you usually use?

A:For small orders, samples, or urgent payments, we accept Western Union. For large orders, we recommend T/T, which ensures the safety of both parties.