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Multi Layer Structure High Density PCB Board Customized Design For Precise Communication

Multi Layer Structure High Density PCB Board Customized Design For Precise Communication

Multi Layer Structure High Density PCB Board Customized Design For Precise Communication
Multi Layer Structure High Density PCB Board Customized Design For Precise Communication
Categories High Density PCB
Brand Name: High Density PCB
Place Of Origin: China
Model Number: Varies by goods condition
Certification: ROHS, CE
MOQ: Sample,1 pc(5 square meters)
Price: NA
Payment Terms: T/T,Western Union
Supply Ability: 3000㎡
Delivery Time: 15-17 work days
Min. Solder Mask Clearance: 0.1mm
Count: 1-30 Layer
Cooper Thickness: 2oz Out Layer , 1oz Inner Layer
Surface Finish: HASL, ENIG, OSP
Layer Count: 1-30
Minimum Via Dia: 0.2mm
Impedance Control: ±10%
Board Thickness: 0.2-5.0mm
Board Size: Customizable
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Company Info.
Dongguan Xingqiang Circuit Board Technology Co., Ltd.
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Multi Layer Structure High Density PCB Board Customized Design For Precise Communication

HD PCBs with Different Surface Treatment Processes are Available.:

High Density PCBs (Printed Circuit Boards), or HDPCBs, are advanced circuit boards characterized by high component density, fine line widths/spacings (typically ≤ 0.1mm), small via sizes (e.g., microvias ≤ 0.15mm), and multi-layer structures. Their core advantage lies in enabling miniaturization, high performance, and reliabilityof electronic devices—making them indispensable in industries where space constraints, signal integrity, and functional complexity are critical.

Features:

1.Ultra-fine traces: Line widths/spacings ≤ 0.1mm (even down to 0.03mm), fitting more conductive paths in limited space.
2. Microvias: Tiny holes (≤0.15mm diameter) in blind/buried/stacked designs, connecting layers without wasting surface area.
3. Multi-layer structure: 8–40+ layers (vs. 2–4 for traditional PCBs) to isolate signals/power and integrate complex circuits.
4. High component density: ≥100 components per square inch, enabling mini devices (e.g., smartwatches) with rich functions.
5. Specialized materials: High-Tg FR-4 (heat-resistant), polyimide (flexible), or PTFE (low signal loss) for harsh environments/high frequencies.
6. Strict precision: Tight tolerances (e.g., ±5% line width error, ≤0.01mm layer alignment) to avoid defects in fine structures.
7. Advanced component compatibility: Supports fine-pitch BGA, CSP, and PoP packages, maximizing vertical/horizontal space use.

Applications:

SectorUse CasesHDI Advantage
ConsumerSmartphones, AR/VR headsets50% size reduction vs. conventional PCBs
AI/ComputingGPU accelerators, server GPUsSupports 25 Tbps/mm² interconnect
MedicalEndoscopic capsules, hearing aidsReliability in 50 GHz) for signal integrity validation.


Product Tags:

Multi Layer Structure High Density PCB

  

HASL Surface 8 Layer HD PCB

  
Quality Multi Layer Structure High Density PCB Board Customized Design For Precise Communication wholesale

Multi Layer Structure High Density PCB Board Customized Design For Precise Communication

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