Customizable FR4 Material HDI Multilayer PCB High Density Interconnect PCB Board

Product Description:

Performance Advantages:

• Miniaturization: 50-70% size/weight reduction vs. conventional PCBs.
• Enhanced Signal Integrity: Shorter paths reduce inductance/crosstalk (critical for >5 GHz).
• Improved Thermal Management: Dense thermal vias under BGAs.
• Higher Reliability: Filled micro-vias resist thermal stress (IPC-7093).
• Design Flexibility: Supports complex ICs (0.35mm-pitch BGAs, SiPs).

Structural Configurations (Common Types)

Key Application Scenarios:

1. Consumer Electronics: Smartphones, tablets, laptops, TWS earbuds, smartwatches, AR/VR headsets, drones.

2. Automotive Electronics: ADAS, battery management systems (BMS), in-vehicle infotainment, central control screens.

3. Medical Devices : Pacemakers, hearing aids, handheld ultrasound devices, endoscopes.

4. Telecom & High-Performance Computing: 5G base stations, high-speed routers, data center servers, AI accelerators.

5. Aerospace & Military Electronics: Radar systems, avionics, satellite modules, missile guidance equipment.

FAQ:

Q: What is the brand name of this PCB product?

A: The brand name of this PCB product is High Density PCB.

Q: Where is this PCB product manufactured?

A: This PCB product is manufactured in China.

Q: What makes the High Density PCB unique?

A: The High Density PCB is known for its compact design and ability to accommodate a high number of components within a small area.

Q: Are the High Density PCBs suitable for high-performance electronic devices?

A: Yes, the High Density PCBs are ideal for high-performance electronic devices due to their excellent signal integrity and reliability.

Q: Can the High Density PCBs be customized to specific requirements?

A: Yes, the High Density PCBs can be customized to meet specific requirements such as size, number of layers, and material composition.