fcbga package substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ...

Brand Name:Mingseal

Model Number:GS600SU

Place of Origin:China

FCBGA Packaging CUF Application Inline Jet Underfill Dispenser The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine ...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:XILINX / AMD

Model Number:XC7K160T-L2FBG676E

Place of Origin:original

...FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V Number of LABs/CLBs 12675 Number of Logic Elements/Cells 162240 Total RAM Bits 11980800 Number of I/O 400 Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA...

Brand Name:UNICOMP

Model Number:AX9100max

Place of Origin:China

... a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic ...

Brand Name:Original Factory

Model Number:XCVC1902-1LSIVSVA

Place of Origin:CN

Integrated Circuit Chip System On Chip IC XCVC1902-1LSIVSVA 2197-FCBGA Package Product Description Of XCVC1902-1LSIVSVA XCVC1902-1LSIVSVA is built around an integrated shell composed of a programmable network on chip (NoC). Specification Of ...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:wuxi special ceramic

Place of Origin:China

Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...

Brand Name:Microchip

Model Number:VSC7464YIH-02

Place of Origin:USA

...FCBGA-672 VSC7431YIH-01 VSC7432YIH-01 Manufacturer: Microchip Product Category: Ethernet ICs Installation style: SMD/SMT Package / Box: FCBGA-672 Product: Ethernet Switches Data Rates: 10 Mb/s, 100 Mb/s, 1 Gb/s, 10 Gb/s Interface type: GPIO, JTAG, PCIe, SPI Minimum working temperature: - 40 C Maximum working temperature: + 125 C Series: VSC7464 Package...

Place of Origin:China

...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along

Brand Name:Broadcom Limited

Model Number:PEX8648-BB50RBCG

...FCBGA-676 Rohs Code Yes Part Life Cycle Code Active Ihs Manufacturer BROADCOM INC Package Description FCBGA-676 Reach Compliance Code compliant HTS Code 8542.31.00.01 Bus Compatibility I2C JESD-30 Code S-PBGA-B676 JESD-609 Code e1 Moisture Sensitivity Level 4 Number of Terminals 676 Package Body Material PLASTIC/EPOXY Package Code BGA Package Shape SQUARE Package...

Place of Origin:USA

... Integrated Circuits AM6421BSFGHAALV FCBGA-441 Microprocessors - MPU Specifications Product Attribute Attribute Value Manufacturer: Texas Instruments Product Category: Microprocessors - MPU Mounting Style: SMD/SMT Package / Case: FCBGA-441 Series: AM6421 ...

Brand Name:Xingqiang

Model Number:As Per Customer's Model

... substrates support critical signal routing, thermal dissipation, and mechanical stability for advanced semiconductor applications. Our team tailors layer structures, ...

Brand Name:ZL

Model Number:ZL-2303

Place of Origin:China

GB / T1720 - 88 Manual or electric Operation Film Electric Adhesion Tester Equipment Description: Electric film adhesion tester, determination of Planning circular path through the film adhesion properties. To Yuangun line scratches integrity within the ...

Brand Name:Xilinx Inc.

Model Number:XC5VFX100T-1FF1738C

...FCBGA-1738 Field Programmable Gate Array Product Attribute Attribute Value Manufacturer: Xilinx Product Category: FPGA - Field Programmable Gate Array Product: Virtex-5 Number of I/Os: 680 I/O Operating Supply Voltage: 1 V Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C Mounting Style: SMD/SMT Package / Case: FCBGA...

Brand Name:Original Factory

Model Number:TMS320C6416TBGLZA8

Place of Origin:China

TMS320C6416TBGLZA8 FCBGA-532 Product Description XT interconnect technology for superior thermal performance Enhanced avalanche capability SMD package for direct integration to PCB Sense pins for optimized switching performance FAQ Q1: How long is your ...