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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Categories Electronics X Ray Machine
Brand Name: UNICOMP
Model Number: AX9100max
Certification: CE, FDA
Place of Origin: China
MOQ: 1 set
Price: can negotiate
Payment Terms: L/C,T/T
Supply Ability: 100set/montrh
Delivery Time: 15 days
Packaging Details: Unicomp Wood.
Monitor: 27 "HD display
System OS: Windows10 64-bit
Hard Disk: 1TB
RAM: 16G
CPU Model: i7
Company Info.
Unicomp Technology
Verified Supplier
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Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

The Unicomp AX9100max X-ray Inspection Systemis engineered specifically for IGBT module analysis and serves a broad range of industries, including:

BGA/CSP/Flip Chip packaging

LED & optoelectronic components

Fuse & diode manufacturing

PCB & semiconductor assembly

Battery production

Small metal castings

Electronic connector modules & cables

Photovoltaic (PV) cell inspection


Application Fields
Application fields diagram of Unicomp AX9100max X-ray Machine
Application fields of Unicomp AX9100max X-ray Machine

Functions and Features
Functions and features diagram of Unicomp AX9100max X-ray Machine
Functions and features of Unicomp AX9100max X-ray Machine
Inspection Image
Sample inspection image from Unicomp AX9100max X-ray Machine












Sample inspection image from Unicomp AX9100max X-ray Machine

Technical Parameters and Specifications
Technical specifications diagram of Unicomp AX9100max X-ray Machine





































Technical specifications of Unicomp AX9100max X-ray Machine

Dimensions and Appearance
Dimensions and appearance diagram of Unicomp AX9100max X-ray Machine
























Dimensions and appearance of Unicomp AX9100max X-ray Machine
Quality Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis wholesale
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