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| Categories | High Speed PCB |
|---|---|
| Brand Name: | Bicheng |
| Model Number: | BIC-332.V1.0 |
| Certification: | UL, ISO9001, IATF16949 |
| Place of Origin: | CHINA |
| MOQ: | 1PCS |
| Price: | USD9.99-99.99 |
| Payment Terms: | T/T |
| Supply Ability: | 5000PCS per month |
| Delivery Time: | 8-9 working days |
| Packaging Details: | Vacuum bags+Cartons |
| Base material: | Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G) |
| Layer count: | 12 layers |
| PCB thickness: | 2.12mm |
| PCB size: | 220mm x 60mm per unit (tolerance: ±0.15mm) |
| Silkscreen: | White |
| Solder mask: | Blue |
| Copper weight: | Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up) |
| Surface finish: | Electroless Nickel Immersion Gold (ENIG) |
| Company Info. |
| Bicheng Electronics Technology Co., Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
This 12-layer rigid PCB is engineered with Panasonic Megtron6 (M6) R-5775—an advanced high-speed, low-loss copper-clad laminate (CCL)—to deliver exceptional signal integrity and reliability for demanding high-frequency applications.
PCB Details
| Parameter | Specification |
| Layer Count | 12-layer rigid PCB |
| Base Material | Megtron6 (M6) R-5775G(HVLP) + Prepreg R-5670(G) |
| Board Dimensions | 220mm x 60mm per unit (tolerance: ±0.15mm) |
| Finished Board Thickness | 2.12mm |
| Copper Weight | Outer Layers (L1, L12): 1oz (1.4 mils / 35μm)Inner Layers: 0.5oz (0.7 mils / 17μm) or 1oz (35μm) (per stack-up) |
| Via Plating Thickness | 25μm |
| Minimum Trace/Space | 3 mils / 3 mils |
| Minimum Hole Size | 0.2mm |
| Vias | 459 total (no blind vias); 0.2mm & 0.4mm vias filled with resin + capped plating |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Silkscreen | Top (L1): White; Bottom (L12): White |
| Solder Mask | Top (L1): Blue; Bottom (L12): Blue |
| Quality Assurance | 100% Electrical test prior to shipment |
| Artwork Format | Gerber RS-274-X |
| Quality Standard | IPC-Class-3 |
Precise PCB Stack-up
| Layer Type | Specification | Thickness |
| Copper Layer (Outer Top - L1) | Copper_layer_1 | 35μm (1oz) |
| Prepreg | R-5670(G) 1080 (68%) × 1 | 81.4μm |
| Copper Layer (Inner - L2) | Copper_layer_2 | 35μm (1oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L3) | Copper_layer_3 | 17μm (0.5oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 219.9μm |
| Copper Layer (Inner - L4) | Copper_layer_4 | 17μm (0.5oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L5) | Copper_layer_5 | 17μm (0.5oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 216.5μm |
| Copper Layer (Inner - L6) | Copper_layer_6 | 35μm (1oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 400μm (thick core for stability) |
| Copper Layer (Inner - L7) | Copper_layer_7 | 35μm (1oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 215.6μm |
| Copper Layer (Inner - L8) | Copper_layer_8 | 17μm (0.5oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L9) | Copper_layer_9 | 17μm (0.5oz) |
| Prepreg | R-5670(G) 3313 (59%) × 2 | 219.8μm |
| Copper Layer (Inner - L10) | Copper_layer_10 | 17μm (0.5oz) |
| Megtron6 Core | M6 Core R5775G(HVLP) | 75μm |
| Copper Layer (Inner - L11) | Copper_layer_11 | 35μm (1oz) |
| Prepreg | R-5670(G) 1080 (68%) × 1 | 81.4μm |
| Copper Layer (Outer Bottom - L12) | Copper_layer_12 | 35μm (1oz) |
Critical Impedance Control (50 Ohm Single-Ended)
| Impedance ID | Configuration | Layer | Trace Width | Reference Layers | Target Impedance |
| Impedance-1 | Single-Ended | L1 (Top Outer) | 5.71 mils | Down: L2 | 50 Ohms |
| Impedance-2 | Single-Ended | L3 (Inner) | 4.31 mils | Upper: L2; Down: L4 | 50 Ohms |
| Impedance-3 | Single-Ended | L5 (Inner) | 4.71 mils | Upper: L4; Down: L7 | 50 Ohms |
| Impedance-4 | Single-Ended | L8 (Inner) | 4.51 mils | Upper: L7; Down: L9 | 50 Ohms |
| Impedance-5 | Single-Ended | L10 (Inner) | 4.31 mils | Upper: L9; Down: L11 | 50 Ohms |
Megtron6 (M6) R-5775 Material Overview
Panasonic Megtron6 (M6) R-5775 is a premium multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and high-reliability electronic systems. Designed to address the stringent demands of 5G, millimeter-wave, and high-performance computing (HPC) applications, it combines low dielectric loss (Df), stable dielectric constant (Dk), and exceptional thermal reliability—enabling seamless transmission of high-speed signals with minimal attenuation.
As a halogen-free, RoHS-compliant material, Megtron6 aligns with green manufacturing standards while supporting 4–30 layer PCB designs, making it versatile for complex circuit architectures. Its compatibility with traditional FR-4 processing technology eliminates the need for special equipment, reducing production costs without compromising performance.
Key Features of Megtron6 (M6) R-5775
| Property | Specification |
| Dielectric Constant (Dk) | 3.4 (1GHz/23°C); 3.34 (13GHz) |
| Dissipation Factor (Df) | 0.002 (1GHz/23°C); 0.0037 (13GHz) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 16 ppm/°C; Y-axis: 16 ppm/°C; Z-axis: 45 ppm/°C |
| Glass Transition Temperature (Tg) | >185°C (DSC method); 210°C (DMA method) |
| Thermal Decomposition Temperature (Td) | 410°C (TGA method) |
| Layer Support | 4–30 layer multilayer PCB designs |
| Environmental Compliance | RoHS-compliant; Halogen-free |
| Manufacturing Compatibility | Traditional FR-4 processing (no special equipment required) |
| Flammability Rating | UL 94 V-0 |
Typical Applications
This 12-layer Megtron6 PCB is tailored for high-performance, high-frequency systems across industries:
-5G Communication: Millimeter-wave antennas, AAU (Active Antenna Unit) RF front-ends, and 5G base station hardware.
-Automotive Electronics: 77GHz millimeter-wave radar, ADAS (Advanced Driver-Assistance Systems), and autonomous driving sensors.
-Data Centers: High-speed server motherboards, 400G/800G optical module PCBs, and high-bandwidth interconnects.
-Aerospace & Defense: Satellite communication systems, high-frequency radar circuits, and avionics.
-Consumer Electronics: Wi-Fi 6E/7 routers, AR/VR devices, and high-performance computing peripherals.
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