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Customized Chip Tray With A Pocket Size Of 8.2* 9.2*2.8mm Suitable For The Semiconductor Industry

Categories Electronic Components Tray
Brand Name: Hiner-pack
Model Number: HN24013
Place Of Origin: CHINA
Certification: ISO9001, SGS, ROHS
MOQ: 500 PCS
Price: TBC
Packaging Details: 80~100pcs/carton
Delivery Time: 1~2 Weeks
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day
Customized Service: Support Standard And Non-standard
Tray Features: ESD Stackable
Processing: Injection
Color: Black
Certifications: ISO 9001, ROHS, SGS
Mold No: HN24013
Warpage: Less Than 0.76mm
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Customized Chip Tray With A Pocket Size Of 8.2* 9.2*2.8mm Suitable For The Semiconductor Industry

Product Description:


  • JEDEC Trays support flexible customization services to accommodate the diverse needs of different customers. Clients can fine-tune the tray dimensions based on the specific characteristics of their IC products, ensuring an optimal fit for particular IC sizes
  • In addition, material types can also be selected according to the needs of actual usage scenarios. For example, when working in high-temperature environments, high-temperature resistant materials can be used, providing strong support for personalized production and special application scenarios of enterprises

Features:

External dimensions

355.35*225.35*10mm

Pocket Size8.2*9.2*2.8mm
Matrix QTY

12*22=264 PCS

Material

Black ABS/PC

CertificationsISO 9001, ROHS, SGS
Mold NoHN24013
ProcessingInjection
WarpageLess Than 0.76mm
Surface Resistant

1.0x10E4~1.0x10E11Ω


Applications:


  • The packaging and testing process of consumer electronics chips, such as smartphone chips and tablet chips, is used to carry the chips and complete various processing procedures.
  • Computer chip manufacturing, including the production flow of CPUs, GPUs, memory chips, etc., ensures stable transmission of chips between various processes. ​
  • In the field of IoT chips, we provide storage and transportation support for various IoT sensor chips and communication chips, meeting the needs of miniaturization and high precision of IoT devices.




Packaging and Shipping:

  • The JEDEC IC Trays are designed to securely hold integrated circuit (IC) components during shipping and storage. These trays are made of durable materials to protect the ICs from damage and ensure safe handling.
  • Packaging: The JEDEC IC Trays are packaged in sturdy cardboard boxes to prevent any potential damage during transportation. Each tray is individually wrapped in protective material to further safeguard the IC components.
  • Shipping: The JEDEC IC Trays are shipped in boxes with appropriate cushioning to absorb any shocks or impacts during transit.


FAQ:


Q1: What is the brand name of the IC trays?

A1: The brand name of the IC trays is Hiner-pack.


Q2: What is the model number of the IC trays?

A2: The model number of the IC trays is JEDEC TRAY SERIES HN24013.


Q3: Where are the IC trays manufactured?

A3: The IC trays are manufactured in China.


Q4: What certifications do the IC trays have?

A4: The IC trays are certified with ISO9001, SGS, and ROHS.


Q5: What is the minimum order quantity for the IC trays?

A5: The minimum order quantity for the IC trays is 500 PCS.

Quality Customized Chip Tray With A Pocket Size Of 8.2* 9.2*2.8mm Suitable For The Semiconductor Industry wholesale
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