bga fcbga package substrate

Brand Name:Horexs

Model Number:HRX

Place of Origin:CHINA

... Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one of the leading and fast-growing Chinese IC substrate manufacturer.Which was located in Huangshi city of Hubei province China. Factory-Hubei is more than 60000 square meters floor space, which

Brand Name:UNICOMP

Model Number:AX9100max

Place of Origin:China

... a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic ...

Brand Name:Mingseal

Model Number:GS600SU

Place of Origin:China

FCBGA Packaging CUF Application Inline Jet Underfill Dispenser The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine ...

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:XILINX / AMD

Model Number:XC7K160T-L2FBG676E

Place of Origin:original

...FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V Number of LABs/CLBs 12675 Number of Logic Elements/Cells 162240 Total RAM Bits 11980800 Number of I/O 400 Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA...

Brand Name:Hiner-pack

Model Number:HN1837

Place of Origin:Shenzhen China

BGA IC Packaging Black JEDEC Matrix Trays ESD Stable Surface BGA IC Packaging Solution ESD Stable Surface Resistance Matrix Tray JEDEC Tray/Matrix Tray/IC Tray/ESD Packing ...

Brand Name:Original Factory

Model Number:STM32F439NIH6

Place of Origin:CN

...BGA-216 Package Product Description Of STM32F439NIH6 STM32F439NIH6 is a 32-bit RISC processor that features exceptional code-efficiency, delivering the high-performance expected from an Arm core in the memory size usually associated with 8- and 16-bit devices. Specification Of STM32F439NIH6 Part Number: STM32F439NIH6 Package: BGA...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Brand Name:JIMA

Model Number:EDCU-HC

Place of Origin:china

...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:ADI

Model Number:ADSP-BF707BBCZ-4

Place of Origin:KOREA

ADSP-BF707BBCZ-4 Digital Signal Processors & Controllers - DSP, DSC Low Cost Sngl Core BF+ W/Large Int'l Mem FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other ...

Brand Name:Broadcom Limited

Model Number:PEX8648-BB50RBCG

...FCBGA-676 Rohs Code Yes Part Life Cycle Code Active Ihs Manufacturer BROADCOM INC Package Description FCBGA-676 Reach Compliance Code compliant HTS Code 8542.31.00.01 Bus Compatibility I2C JESD-30 Code S-PBGA-B676 JESD-609 Code e1 Moisture Sensitivity Level 4 Number of Terminals 676 Package Body Material PLASTIC/EPOXY Package Code BGA Package Shape SQUARE Package...

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of package

Place of Origin:TAIWAN

Brand Name:ATI

Model Number:216-0731004

...BGA GPU chips video 216-0731004 is a GPU chip. Place of Origin: TAIWAN Brand Name: ATI Model Number: 216-0731004 Type: Drive IC Application: MP3/MP4 Player Supply Voltage: 3V Dissipation Power: W Operating Temperature: C package: FCBGA WE also have others BGA...

Brand Name:Bicheng

Model Number:BIC-462.V1.0

Place of Origin:CHINA

... General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on

Brand Name:ON

Place of Origin:China

...XC6VSX475T-1FFG1156I FCBGA-1156 Programmable IC Chip is a type of gate array IC, which integrates analog multiplexer IC and can be programmed according to user's needs. It features a variety of packages, including DIP, SOIC, QFP and BGA. It can operate und...

Brand Name:Bicheng Technologies Limited

Model Number:BIC-462-V7.8

Place of Origin:China

... General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:XCE

Model Number:XCEM

Place of Origin:China

... of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example) Yellow and white core plate divided core material, usually ...

Brand Name:wuxi special ceramic

Place of Origin:China

Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...