wafer dicing blade

Brand Name:TONGYU INDUSTY

Model Number:RTR1A8-006

Place of Origin:CHINA

...2mm ( D * H * T) We use resin powder to increase the flexibility of cutting blades in order to supply high performace of flexible cutting for many objects. such like to Semiconductor,Optical Glass, Ceramics, Magnetic Material etc. Diamond ...

Brand Name:HT

Model Number:HT-WSB

Place of Origin:China

... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,

Brand Name:Hiner-pack

Model Number:HN24725

Place of Origin:Made In China

... processing technology, and strict quality control, has reached industry-leading levels in durability, positioning accuracy, and safety of use. Semi-Wafer Cutting Frame Ring (1)This wafer dicing frame is

Brand Name:ZMSH

Model Number:Microjet laser technology equipment

Place of Origin:CHINA

Abstract of microjet laser technology equipment Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing Microjet laser equipment is a kind of precision machining system that combines high energy laser and micron-scale ...

Brand Name:CAEC

Place of Origin:Henan, China

...Dicing Blades Metal Bonded Abrasives Dicing Saw Blade Product overview Metal bond dicing blades are made of identical material,with thin thickness and high precision, they are mainly used for grooving and cutting with high accuracy and narrow cutting depth. Specification 1A8/1 type, without water slot. 1A8/2 type, with water slot. Main features The grits are strongly held by the metal bond, high precision, minimized blade...

Brand Name:ZG

Model Number:MS

Place of Origin:CHINA

Dicing Blades Dicing Blades, For High-Precision Slicing And Dicing Of Soft To Hard Materials Of Many Different Types And Elements Our blade technologies are designed and developed for high-precision slicing and dicing of soft to hard materials of many different types and elements, that are used in hard disk drive, optical, and semiconductor applications. Blades...

Place of Origin:China

Metal & Resin Bond Dicing Blade Ultra thin dicing blades are widely used in semiconducto industry Features: Metal bond can hold grit size strongly high precision good shape holding good wear resistant and long using life Specification: Specifications: ...

Brand Name:ZMSH

Place of Origin:China

Automated Precision Dicing Machine​ ​High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics...

Place of Origin:Henan, China

Brand Name:Henan Huafood Machinery

Automatic Multipurpose Bacon Cooked Meat Slicing Machine Carrot Vegetable Slicer Machine Cooked meat slicer machine introduction: This machine is a machine for cutting cooked meat. It uses special three blades to cut barbecued pork, braised pork, pig scalp...

Model Number:BZSY-01

Place of Origin:China

Silk Road Enterprise Portable Blue 4 Dicing Blades Vegetable Cutter with Drain Basket Product Features New Upgrade - New vegetable slicer comes with a unique drainage feature that allows you to clean vegetables directly through the drainage system after...

Brand Name:YUSH

Model Number:YSL-1000SD

Place of Origin:JiangSu

... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Semi-auto dicing The semi-auto dicing system, refers to a dicing system

Categories:PCB/PCBA Cleaning Machine

Country/Region:china

... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Auto dicing Auto-dicing system, refers to a dicing system which all

Brand Name:JiuYing

Model Number:TJ-800

Place of Origin:Guangzhou, China

TJ-800 Electric Industrical Onion Dicing Machine Feature 1. TJ-800 has 3 knives:slicing blade+shredding blade+dicing blade,which can reduce leftover material,while it is operating. 2. Feeding:carrot ,turnip, potata, sweet potato, onion, mango etc.Vegetable...

Place of Origin:China

Brand Name:Sanxin

Model Number:SX2061

...Blade for Silicon Wafer Metal Cutting We proudly introduce the high-precision tungsten carbide shear blade designed for the metal sheet cutting, specifically tailored for cutting silicon wafer metals. Manufactured and customized by Zhuzhou Sanxin Tungsten carbide, these blades...

Brand Name:Honghui

Model Number:1xN

Place of Origin:china

... controlled within ±0.1-1.8dB (depending on specifications), ensuring consistent splitting after dicing and preventing uneven signal strength at terminals. Broad-Spectrum Compatibility: Supports full working band of 1260-1650nm, perfectly ...

Brand Name:Perfect Laser

Model Number:PE-20W/50W

Place of Origin:China

Fiber Laser Cell Solar Silicon Wafers Scribing / Cutting / Dicing Easy Operation ※Product Introduction Solar technologies use the sun's energy to provide heat, light, hot water, electricity, and even cooling, for homes, businesses, and industry. Despite ...

Brand Name:EPS

Place of Origin:China

... performance for beef, pork, poultry, and other types of frozen meat. Constructed with food-grade stainless steel and equipped with high-efficiency dicing blades, the machine ensures safe, hygienic,

Brand Name:Daway

Model Number:D005

Place of Origin:China

... processing, meat and poultry processing, seafood processing, bakery including croissant, cake and bakery for applications like cutting, slicing, dicing and many others.

Brand Name:JC

Model Number:ETCH-036

Place of Origin:China

... and edge-contact features to prevent contamination and damage, ensuring thermal stability and chemical resistance in harsh plasma environments. Description Blade Quartz 300mm Specification 330.1×152.3×8.95T or

Brand Name:No

Place of Origin:Shandong,China

...Dicing Machine 1. It could cut leafy vegetables, such as scallion, garlic, leek, celery, Chinese cabbage, spinach, lettuce, etc. 2. It could cut root vegetables like carrot, onion, bamboo shoots, eggplant into strip, slice or cube shape by changing the blades. 3. The speed of blades...