thermal gap pad for memory modules

Brand Name:Ziitek

Model Number:TIF120-02S

Place of Origin:China

... thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and

Brand Name:ZIITEK

Model Number:TIF1200-30-06UF

Place of Origin:China

Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives ...

Brand Name:Ziitek

Model Number:TIF100-19U

Place of Origin:Vietnam

... allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling. Features > Good thermal conductivity 1

Brand Name:PF

Model Number:00

Place of Origin:Guangdong,China Mainland

...thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or product outer covering. APPLICATION * Communication equipment * LED lighting * Switch power supply * Backlight module...

Brand Name:AOK

Model Number:TM300

Place of Origin:China

Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥5.0 ASTM D149 Dielectric Constant(@10mhz...