Memory Card Ultra Thin FR4 Multi Layer Pcb For Encapsulation
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                                            Application:Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished ......                                         
                                            HongRuiXing (Hubei) Electronics Co.,Ltd.
                                         
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