6Inch Vertical Wafer Cassette Box Wafer Transport Container
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...Wafer Cassette Box Overview 6Inch Vertical Wafer Cassette Box Wafer Transport Container The 6-inch wafer cassette box is a high-purity, precision-molded container designed for safe storage, transportation, and handling of 6-inch (150mm) semiconductor wafers. It serves as a critical auxiliary component in wafer......
SHANGHAI FAMOUS TRADE CO.,LTD
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8inch 2inch 4inch 6inch Wafer Carrier Container Cassette Box For Shipment 25pcs
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...wafer carrier container cassette box for wafer shipment factory price 6" Diameter Single Wafer Carrier Box Wafer Box Customized Processing Square Carrier Silicon Wafer Turnover Storage Semiconductor IC Wafer Box Specification item value Place of Origin China Jiangsu Brand Name TONGYA Model Number ty5689 Color Black Product name wafer frame cassette MOQ 1 Pcs Type Laser Machining Size accept custom Packing Foam Box...
SHANGHAI FAMOUS TRADE CO.,LTD
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Transparent Rectangle Wafer Carrier Box 3 Inch Wafer Cassette
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... 3-inch wafer carrier box is a semiconductor wafer packaging solution that meets the specific storage and transportation requirements of a variety of environment. The box can be used to store silicon, glass plate, sapphire Plate, aluminum devices and other...
Shenzhen Hiner Technology Co., Ltd.
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12”5 Nano Semiconductor Wafer Chip With EUV Technology
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...wafer can also be taken out. Each chip can take about 130 wafers, and the box is sent by air in a box of three kilograms. It can also be shipped in domestic ports. If necessary, please contact us. Taiwan channel direct hair. This is a subsidiary of our group for wafer and chip projects (uncut material, defective brand, finished product), and usable wafers......
Shenzhen Chuangying Times Technology Co., Ltd.
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Soi Wafer Silicon on Insulator Semiconductor Wafer
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...Wafer Silicon on Insulator Semiconductor Wafer SOI Wafer (Silicon On Insulator) * SOI Wafer sizes from 3" to 200mm, some in inventory * Very high quality with tight TTV on device layer thickness * Direct Si-Si bonding and double sided SOI available * Any Si orientation, any device thickness over 1.5um * Single and double side polished * Small lot sizes and Laser marking of wafers available * Short lead time delivery TYPES OF SOI WAFER...
Shenzhen A.N.G Technology Co., Ltd
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Semiconductor Wafers Ultrasonic Cleaning System 100KW Automated Ultrasonic Cleaner
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...Cleaning System For Semiconductor Wafers Intelligent Cleaning: The equipment adopts a fully automatic feeding and discharging cleaning mode to clean the silicon wafers. Meanwhile, the equipment is compatible with cleaning silicon wafers of various sizes......
guangdong Jietai Ultrasonic cleaning Equipment Co., Ltd.
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N Type, InAs Wafer, 2”,Prime Grade,Epi Ready-Semiconductor Wafer Manufacturing
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... wafer diameters range from 25.4 mm (1 inch) to 100 mm (6 inches) in size; wafers can be produced in various thicknesses and orientations with polished or unpolished sides and can include dopants. PAM-XIAMEN can produce wide range grades: prime ......
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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Semiconductor Wafer Saw Blade Thickness 0.015 mm-0.3 mm Gallium Phosphide
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... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,...
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Precision CNC Components Wafer Rail 7075 Aluminum Alloy Semiconductor Wafer Transfer Guides
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...Semiconductor Wafer Transfer Guides 7075 aluminium alloy is ideally suited for the manufacture of semiconductor wafer transfer guides due to its high strength, good corrosion resistance, low density and excellent machinability. Its performance can be further enhanced by appropriate heat treatment and surface treatment to meet the stringent requirements for precision and reliability in semiconductor......
JimaFor
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Ultrasonic Semiconductor Wafer Coating Continuous
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...Semiconductor Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ultrasonic semiconductor wafer coating technology is suitable for wafer coating, which can achieve process speed, thickness control, and material uniformity. After the hot or UVB stage and wafer...
Hangzhou Qianrong Automation Equipment Co.,Ltd
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