Precision 0.15mm IC Packaging Substrate Fabrication V2 Flame Retardant
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Precision 0.15mm IC Packaging Substrate fabrication Application:bank card,IC card,SIM card,Dram memory electronics,Sd card,memory card,all kind of memor ycard,MicroSD,MicroTF card,Flash memory card,DDR,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Memory card,MicroSD card,MicroTF card,Memory card;Semiconductor,IC package,IC assembly,Semi packaging,IC substrate......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...IC Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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...Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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Customizable Recyclable Varnished Cardboard Rigid Packaging Paper Boxes Magnetic Gift Box For Cosmetics
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...' demands Application packaging,daily life application etc QC Each production process Shipping As customers' demands MOQ 100PCS Each production process OEM service,Quick and resonable quotation,fashion design and precise printing Surface finish...
Dongguan Efun Electronic Technology Co., Ltd
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High Precision IC Bonding Machine 8-12 Inch Wafers Die Bonders
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...Precision IC Bonding Machine WBD2200 PLUS 8-12 Inch Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die bonding technology Bottom photo-taking, high precision......
Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
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OPA2388QDGKRQ1 Amplifier IC Chips Dual Automotive Qualified Wide-Bandwidth Precision Amplifier Package VSSOP-8
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OPA2388QDGKRQ1 Amplifier IC Chips Dual Automotive Qualified Wide-Bandwidth Precision Amplifier Package VSSOP-8 GBP - Gain Bandwidth Product: 10 MHz SR - Slew Rate: 5 V/us CMRR - Common Mode Rejection Ratio: ......
Shenzhen Sai Collie Technology Co., Ltd.
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24 CH Optical Fiber Array With High Precision V-Groove Substrate
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24 CH fiber array with high precision V-groove substrate Description: Seacent's fiber arrays are fabricated with high precision V-groove substrate by Browave unique assembly/polish process to get an excellent accuracy of fiber core position and perfect......
Shenzhen Seacent Photonics Co.,Ltd.
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Universal JEDEC Matrix Tray Stackable For IC Packaging Industry
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... Matrix Tray Stackable For IC Packaging Industry Offering both standard and custom configurations, our JEDEC trays meet a wide range of semiconductor packaging needs. This JEDEC matrix tray is crafted for precision and efficiency in electronics component ......
Shenzhen Hiner Technology Co., Ltd.
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