Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W
                                         
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                                            Low Melting Point Thermal Phase Changing Materials 0.95 W / mK with 0.024℃-in² / W The TIC™803Y Series is low melting point thermal interface material. At 50℃, The TIC™800Y Series begins to soften and flow, filling the microscopic irregularities......                                         
                                        
                                            Dongguan Ziitek Electronic Materials & Technology Ltd.
                                         
                                        
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Wholesale 2.5W/mK Thermal Conductivity Phase Change Material for CPU Cooling
                                         
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                                            Wholesale 2.5W/mK Thermal Conductivity Phase Change Material for CPU Cooling With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR......                                         
                                        
                                            Dongguan Ziitek Electronical Material and Technology Ltd.
                                         
                                        
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TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS
                                         
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                                            .... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can ......                                         
                                        
                                            ZSUN CHIPS CO., LTD
                                         
                                        
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