High Performance Low Cost CPU Thermal Pad TIFT500-30-11US With Blue Color For Various Electronic Device
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... to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. TIF500-30-11US Series thermally conductive interface materials are applied to...
Dongguan Ziitek Electronical Material and Technology Ltd.
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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling
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Low-Melting Laptop CPU Thermal Pad PCM Phase Change Material For Gap Filling With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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TIF200-20-02ES Ultra Soft CPU Thermal Pad For Telecommunication Hardware
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... Soft CPU Thermal Pad For Telecommunication Hardware Product descriptions TlFTM200-20-02ES is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress ......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
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...Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Attribute Value Test Method Composition Ceramic Filler + Silicone - Color Pink Visual Thickness(mm) 0.5~10 astm d374 Density(g/cc) 3.35 ASTM D792 Hardness(shore oo) 55±10 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ＞6.0 ASTM D149 Dielectric Constant(@10mhz) 7.2 ASTM D150 Volume Resistivity(Ω.cm) 1012 ASTM D257 Flammability V-0 UL94 Thermal...
Shenzhen Aochuan Technology Co., Ltd
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High Volume Resistivity Custom CPU Thermal Pad with Options Density 3.0±0.5 G/cm3
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Product Description: With an operating temperature range of -40°C to 200°C, this Silicone Thermal Pad can easily handle extreme temperatures, making it a perfect choice for use in high-temperature applications. Its continuous use temperature range of -40......
Shenzhen Antac Technology Limited
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Polyester Low Melt Fibers Thermal Bonding Machine Soft Cap Wadding Machine Production Line
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Thermal Bonded Wadding Production Line Nonwoven Thermal Bonding Production Line Thermal bonded wadding production line processes polyester fibers and low melt fibers through opening, blending, carding, web forming, web bonding, and drying processes to ......
Changshu Sail Nonwoven Machine Co., Ltd.
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Coated Paper Hang Tab Box Packaging For Silicone CPU Thermal Pads SIM CARD
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Shenzhen Senwi Printing & Packaging Co., Ltd.
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Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
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... thermal conductive material for soft gap filling. Product Features : Highly conformal. High thermal conductivity. Low modulus. Non-fiberglass options for applications requiring further stress reduction. Glass fiber reinforced to improve workability and...
SZ PUFENG PACKING MATERIAL LIMITED
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A Grade High Quality Low Melt Polyester Staple Fiber 4D For Padding
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...Low Melt Polyester Staple Fiber 4D×51mm For Padding White Definition: LMF or Low melt staple fiber is a fiber which is produced by using polyester and modified polyester to spin simultaneously. It has a lower melting point from 90 degrees to 220 degrees. 110℃ LMF is the most common in the market. When heated to 110-150 ℃, the sheath layer can melt and generate a sheath-core or side-by-side structure. Low melt......
Guangzhou Octopus Fiber Co.,Ltd.
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Thickness 0.08mm Thermal Bonding Film Low Melt Point For Laminating Fabric
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...e of thermoplastic polyurethane (TPU). TPU hot melt adhesive film possesses excellent thermal melting properties and adhesive characteristics, allowing it to quickly bond to various substrates when heated. The TPU hot melt adhesive film is commonly used in...
Shenzhen Tunsing Plastic Products Co., Ltd.
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