High Tensile Strength Low Helium Leak Rate Metallized Ceramics Component with High Thermal Conductivity
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Metallized Ceramics Component ZG supplies custom Metalized Alumina Ceramics. These metallized ceramics are ideal for use within high vacuum, high voltage and high pressure applications. We provide metallized ceramic for power grid tubes, vacuum ......
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
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Manufacturer Hot Sale Thermal Conductive Gel Thermally Conductive Gel With Ultra-High Thermal Conductivity 1.5W Thermal Gel
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...Thermal Conductive Gel Thermally Conductive Gel With Ultra-High Thermal Conductivity 1.5W Thermal Gel TIFTM015-07 is a soft silicone putty thermal gap filler,which blend with exclusive formula,that offer superior thermal performance, and compressibility. Due to TIFTM015-07 is made by high vicosity silicon oil ,that can prevent thermal formula seprate from it. Besides ,compared with traditionally thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
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...high thermal conductivity electronic components heat conduction plate Product features/Applications: High cost performance, high thermal conductivity, low thermal resistance. High adherence, soft and elastic, easy to install, can be repeatedly disassembled. Used in electronic appliances, automotive machinery and other body as heat dissipation, insulation components, notebook computers, computer hosts, power devices, high......
SZ PUFENG PACKING MATERIAL LIMITED
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2oz High Thermal Conductivity PCB Lighting For High Power COB lights
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High Thermal Conductivity pcb Lighting PCB MC PCB Aluminum pcb High Power COB lights PCB led pcb PCB Type Material Type Material Brand Single side pcb Double side ......
FineCircuit Co., Ltd
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Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer
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Thermal Conductive Silica Gel High Thermal Conductivity 7.0W CPU Heat Dissipation Manufacturer Products description TIF®070-11 is a soft silicone gel-based gap filler pad, formulated with a special blend of fillers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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TIF035AB-05S High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel
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...High Thermal Conductive Paste Heat Transfer Gel Double-Component Thermal Conductive Gel TIFTM035AB-05S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Heat Resistant High Thermal Conductivity Mgc Mica Macor Glass Ceramic Structural Parts
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...mica machinable Ceramics: Microcrystalline glass ceramics, also known as machinable ceramics, are mica glass-ceramics with synthetic mica as the main crystalline phase, and are ceramic materials that can be machined. Microcrystalline glass ceramics have excellent processing properties, vacuum properties, electrical insulation properties, and high temperature and chemical resistance. Glass-ceramics with high......
Wuxi Special Ceramic Electrical Co.,Ltd
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Heat Dissipation High Thermal Conductivity Potting Compound In Bulk 50KG
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...Thermally Conductive Potting Compound 1 1 Mix Ratio for Capacitors and Electrical Devices Product Description: Product Summary: The Thermal Conductive Potting Compound is a high-quality heat dissipation potting material designed for LED modules. This thermal conductive potting compound is specifically formulated to provide excellent thermal conductivity......
Shenzhen Hanast New Material co.,LTD
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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High Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and bonding materials configured in a certain ratio, and processed through a special process to become a paste gap filling material, according to the 1:1 (mass ratio) mixed and cured into a high...
Trumony Aluminum Limited
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High Thermally Conductive Interface Pads Gap Filler Thermal Pad Electronics
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... versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. Tflex HD90000 is available in...
ZSUN CHIPS CO., LTD
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