FCBGA/BGA package substrate manufacture
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Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap top (Ultra thin notebook / ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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FCBGA Packaging Jet Underfill Dispenser CUF Inline Cnc Glue Dispenser ISO
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FCBGA Packaging CUF Application Inline Jet Underfill Dispenser The GS600 Series Inline Jet Underfill Dispenser is Mingseal’s next-generation solution engineered specifically for FCBGA encapsulating applications, where process stability, ultra-fine ......
Changzhou Mingseal Robot Technology Co., Ltd.
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2 Layers IC Package Substrate Palladium Gold COF Electric Annoyed Liquid Crystal Drive
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2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ......
Shenzhen Chaosheng Electronic Technology Co.,Ltd
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XC7K160T-L2FBG676E Programmable IC Chip 676-FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V
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...FCBGA Package Embedded FPGAs Automotive Grade Industrial Device 0.93V Number of LABs/CLBs 12675 Number of Logic Elements/Cells 162240 Total RAM Bits 11980800 Number of I/O 400 Voltage - Supply 0.87V ~ 0.93V Mounting Type Surface Mount Operating Temperature 0°C ~ 100°C (TJ) Package / Case 676-BBGA, FCBGA Supplier Device Package 676-FCBGA......
Shenzhen Sai Collie Technology Co., Ltd.
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XCVC1902-1LSIVSVA Integrated Circuit Chip System On Chip IC 2197-FCBGA Package
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Integrated Circuit Chip System On Chip IC XCVC1902-1LSIVSVA 2197-FCBGA Package Product Description Of XCVC1902-1LSIVSVA XCVC1902-1LSIVSVA is built around an integrated shell composed of a programmable network on chip (NoC). Specification Of ......
ShenZhen Mingjiada Electronics Co.,Ltd.
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Precision Packaging Substrate 25-Micron Gloss BOPP Dual-Adhesive Coating Film in 3600mm Jumbo-Roll for Moisture-Proof
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... Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ......
NEWFLM(GUANGDONG)TECHNOLOGY CO.,LTD
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3 / 4 OZ Rolled Copper Foil , Copper Foil Paper For IC Package Substrates
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...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates......
JIMA Copper
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IC Substrate Multilayer Rigid PCB for Mobile Phone EMMC Package Substrate
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Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ......
Shenzhen Tecircuit Electronics Limited
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Optical Communication Packaging Aluminum Nitride Ceramic Substrate
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Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT......
Wuxi Special Ceramic Electrical Co.,Ltd
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TGV Glass Substrate Through-hole Coating Semiconductor Packaging JGS1 JGS2
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Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving......
SHANGHAI FAMOUS TRADE CO.,LTD
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