Silicon Disco Wafer Saw Blade 55.6/55.56mm Glass Industrial Disco Diamond Blade
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... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,...
Zhengzhou Hongtuo Superabrasive Products Co., Ltd.
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Customized Metal 6 8 12 Inch Semi Wafer Dicing Frame Ring Metal Ring Wafer Frame
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... processing technology, and strict quality control, has reached industry-leading levels in durability, positioning accuracy, and safety of use. Semi-Wafer Cutting Frame Ring (1)This wafer dicing frame is...
Shenzhen Hiner Technology Co.,LTD
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Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing
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Abstract of microjet laser technology equipment Micro-Jet Laser Equipment for Silicon Carbide Wafer Rounding & Silicon-Based Wafer Dicing Microjet laser equipment is a kind of precision machining system that combines high energy laser and micron-scale ......
SHANGHAI FAMOUS TRADE CO.,LTD
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Silicon Paper Liner Wafer Dicing Tape for Precise Semiconductor Packaging
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... resistant polyimide material and features a tensile strength of 25N/25mm, a thickness of 0.05mm and a size of 10mm*50m. This tape is suitable for wafer dicing, UV tape release and UV adhesive applications, making it an ideal choice for all types of...
Shenzhen KHJ Technology Co., Ltd
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Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade
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0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade Sample blade specification: 58*40*0.2mm ( D * H * T) We use resin powder to increase the flexibility......
Shaanxi Tongyu Industry And Trade Co,.Ltd
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Automated Precision Dicing Machine Fully Automatic Wafer Dicing Precision Cutting
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Automated Precision Dicing Machine High-Performance Solutions for Semiconductor, Electronics, and Precision Manufacturing The Automated Precision Dicing Machine is designed for ultra-precision cutting of brittle materials such as semiconductors, ceramics......
SHANGHAI FAMOUS TRADE CO.,LTD
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Plastic Wafer Dicing Potato Wedges Cutting Machine Made In China
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Certifications Product Description The vegetable cutting machine can accurately cut "slices, silk, strips" and work efficiently. The speed of the conveyor belt and the speed of the turning knife are adjusted by the frequency converter, and can be ......
Henan Huafood Machinery Technology Co.,Ltd.
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12 Inch Wafer Frame Dicing Cutting Ring Round Fixed Silicon Disk Iron Ring
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...Wafer ring has good resistance to rebound after heat treatment. • Precision machining precision Wafer Iron Ring using laser cutting machine, cutting error is small. • Compatible with various packaging devices Compatible with frame processing device (Disco, TSK, ADT, etc.) Feature: Suitable workmanship wafer sticking, wafer grinding, wafer cutting and SMT etc Suitable for 12" wafers......
Shenzhen Hiner Technology Co.,LTD.
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300LB Disco Lift Wafer Stainless Steel Check Valve Metal Seat
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stainless ss wafer disco lift type check valve for water Check Valve Features XIDELONG H71H LIFT CHECK VALVE Model No H71H Type Non-return Valve MOQ 1 Set Applicable Standard ASME Port Size DN15~DN300 End Connection Wafer Working Pressure PN16~PN64.150LB~......
Wenzhou Xidelong Valve Co. LTD
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Semi Dicing PCB Cutting Machine YSL-1000SD For Glass Ceramic Semiconductor Chip
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... with high accuracy by using spindle’s high-speed rotation driving the cutting blade. Operation procedures Wafer or Strip Tape mounting Dicing Cleaning UV seperation Description of Semi-auto dicing The semi-auto dicing system, refers to a dicing system...
YUSH Electronic Technology Co.,Ltd
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