Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip
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...BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package: BGA Category: Iphone IC Chip Mounting Type: Surface Mount Product Photo Of APL1096/343S00474 Other Electronic Components In Stock Part Number Package PPC405EXR-NPD333T BGA......
ShenZhen Mingjiada Electronics Co.,Ltd.
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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources
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...BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package......
Shenzhen Sai Collie Technology Co., Ltd.
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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Multilayer Rigid Flex Black Fr4 HDI Board PCB BGA Package Manufacturing Service
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Black Multilayer Board HDI PCB BGA Package PCB Manufacturing Service ♦ What is HDI PCB? HDI PCB uses micro blind/buried vias and build-up technology to create high-......
DQS Electronic Co., Limited
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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm
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BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb ......
Chengdu Cesgate Technology Co., Ltd
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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package
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3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich ......
Dongguan Ziitek Electronical Material and Technology Ltd.
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LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package
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LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package FEATURES n Complete Solution in <1cm2 n Wide Input Voltage Range: 3.6V to 20V n 3.3V Input ......
TOP Electronic Industry Co., Ltd.
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0.1mm Stainless Steel Shim SMT Stencil PCB Assembly For BGA Package
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SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It’s fabricated per IPC 7525A......
Bicheng Electronics Technology Co., Ltd
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MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package
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MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit ......
Mega Source Elec.Limited
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New Original E1116AEBG-8E-F BGA Packaged Flash Memory
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New Original E1116AEBG-8E-F BGA Packaged Flash Memory PRODUCT DESCRIPTION Part number E1116AEBG-8E-F is manufactured by ELPIDA and distributed by Stjk. As one of the leading distributors of electronic products, we carry many electronic components from the ......
STJK(HK) ELECTRONICS CO.,LIMITED
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