Moldability For Complex Parts Thermal Interface Materials For Automotive Electronics
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...Thermal Interface Materials For Automotive Electronics Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal......
Dongguan Ziitek Electronical Material and Technology Ltd.
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS
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.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm...
ZSUN CHIPS CO., LTD
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Low-Melting Thermal Interface Material Phase Change Sheet For Power Supply And Vehicle Storage Battery
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...Thermal Interface Material Phase Change Sheet For Power Supply And Vehicle Storage Battery Company Profile Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal......
Dongguan Ziitek Electronic Materials & Technology Ltd.
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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TIC800P Low Melting Point Thermal Interface Materials Thermal Phase Changing Material
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...Thermal Interface Materials Thermal Phase Changing Material The TIC™800P series is low melting point thermal interface material. At 50℃, TIC™800P series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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High Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and ......
Trumony Aluminum Limited
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Automotive Electronics Thermal Conductive Gap Filler
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3.0W/m.K Thermal Conductivity Silicone Gap Filler For UAV With 2.9g/Cc Density Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150......
Shenzhen Aochuan Technology Co., Ltd
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Electronics CPU Silicone Thermal Pad Industry Thermal Interface Pad
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...Thermal Pad For Medical Equipment Field The Silicone Thermal Pad is a high quality and durable thermal interface material, specially designed for electronic components such as CPUs, GPUs, and other heat generating devices. It is made of high temperature silicone rubber, providing excellent thermal conductivity and insulation for efficient heat dissipation. Product Overview The Silicone Thermal...
Shenzhen Antac Technology Limited
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1.4W/M.K LED Thermal Interface Pad , Conductive Thermal Gap Filler Pad Reusable
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... interface between electronic components and heat sink or product outer covering. Specifications: 1. Thermal conductivity 1.0 W/M.K~6.0W/M.K 2. Thickness 0.2-20mm 3. Customized 4. Easy to install APPLICATION * Communication equipment * LED lighting *...
SZ PUFENG PACKING MATERIAL LIMITED
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