Heat Dissipation Metallized Ceramic Substrates , Ceramic Wafer Size Customized
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Heat Dissipation Aluminum Nitride Metallized Ceramic CoB Wafer Specification of ceramic metallised substrate: 1. Available material: Alumina(Al2O3), Aluminum nitride (AlN) and Beryllia (BeO) 2. Size capability: min. size to be 1mm x 1mm, max. size to be ......
Jinghui Industry Limited
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High Power 1200W CRI>95 6500K Copper Board Good Heat Dissipation Led Cob Chip Used in Photography Light/ Video Light
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...Chip level ALN substrate packaging) chip-level aluminum nitride substrate packaging technology. 2.Thermoelectric separation structure, better heat dissipation. 3.Ultra-thin phosphor film layer, improve light density. 4.Unique copper substrate structure ......
Shenzhen Learnew Optoelectronics Technology Co., Ltd.
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6 Layer AlN Substrate Ceramic PCB 1.5mm Thickness For Hassle-free Signal Transmission With Immersion Gold Prototypes Available.
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... conductivity and electrical insulation properties, enabling efficient heat dissipation. The finished board thickness is 1.5mm, and both the inner and outer layers are 1oz finished copper. This PCB is free of solder mask and silkscreen ......
Bicheng Electronics Technology Co., Ltd
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Matte Surface Finish Aluminum Nitride Substrate AlN Substrate Diesel Oxidation Catalyst Engineered for Heat Dissipation
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Product Description: Industrial Ceramic Substrates are essential components widely used in various high-performance applications due to their exceptional thermal, mechanical, and electrical properties. Among these, the Ceramic Substrates designed ......
Jiangsu Province Yixing Nonmetallic Chemical Machinery Factory Co.,Ltd
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3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT
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Molybdenum Copper Substrates For Heat Dissipation 1. Information Of Molybdenum Copper Substrates For Heat Dissipation: Molybdenum-copper substrate is a new type of electronic material. It uses molybdenum as the base and copper as the conductive layer. It......
Shaanxi Peakrise Metal Co.,Ltd
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Alumina Ceramic Heat Dissipation Substrates And Filtration Components: Core Solutions For Electronics And Precision
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Alumina Ceramic Heat Dissipation Substrates and Filtration Components: Core Solutions for Electronics and Precision Instruments Product Introduction Alumina ceramic heat dissipation substrates and filtration components are made from high-purity (96%-99.6%)......
Dayoo Advanced Ceramic Co.,Ltd
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3mm Thickness Molybdenum Copper Substrates For Heat Dissipation And Electrical Connections In IGBT
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Molybdenum Copper Substrates For Heat Dissipation 1. Information Of Molybdenum Copper Substrates For Heat Dissipation: Molybdenum-copper substrate is a new type of electronic material. It uses molybdenum as the base and copper as the conductive layer. It......
Shaanxi Peakrise Metal Co.,Ltd
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5W DC 6GHz 1.27x2.54mm Chip Terminations Surface Mount BeO AlN Substrate
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Chip Terminations 50Ω 5w DC- 6GHz BeO AlN Al2O3 1.27 * 2.54 Standard Resistance: 50Ω Substrate Material: BeO, AlN ,Al2O3 Resistance Tolerance: ±5%(default);±2%;±1% Power Rating: 5W Frequency: DC-6GHz VSWR: 1.25 Power Rating Frequency ......
Shenzhen Yulongtong Electron Co., Ltd.
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UV-resistant Material LED Stadium Lighting with 150lm/W, Sturdy Bracket for Optimal Heat Dissipation
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..., reliable without failure 3030 SMD light source design, luminous efficiency 150lm/W High thermal conductivity aluminum substrate, fast heat dissipation, reduce light decay Die-casting aluminum heat sink The design of the heat dissipation respirator can...
Shenzhen Benwei Lighting Technology Co., Ltd.
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360° Heat Dissipation 20W LED Corn Bulb with white light and constant driver
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360° Heat Dissipation 20W LED Corn Bulb with white light and constant driver Feature The air holes are evenly distributed on the aluminum substrate, and the heat dissipation is 360° by thermal aerodynamics to ensure the service life of the bulb. Constant ......
Aina Lighting Technologies (Shanghai) Co., Ltd
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