RoHS 2.0mmT 3.2W/M-K Silicon Thermal Pad For High Speed Mass Storage Drives
|
|
...2W/M-K Silicon Thermal Pad High durability For High speed mass storage drives Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone......
Dongguan Ziitek Electronical Material and Technology Ltd.
|
Highly Efficient Thermal Conductivity 1.2W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials
|
|
Highly Efficient Thermal Conductivity 1.2W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials The TIF®100-12-66U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat ......
Dongguan Ziitek Electronic Materials & Technology Ltd.
|
TIF100-20-11PSA Silicone Thermal Pad With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling
|
|
...Silicone Thermal Pad With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling Products description Ziitek TIF™100-20-11PSA series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal......
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
|
Electrical Isolation Non Silicone Thermal Pad
|
|
...±5 ASTM D2240 Usage Temperature(℃) -40~150 -- Electrical Breakdown Voltage(kv/mm) ≥6.0 ASTM D149 Flammability V-1 UL94 Thermal Thermal conductivity(W/m.K) 2.0 ASTM D5470 Product feature ■ Thermal conductivity:2.0,3...
Shenzhen Aochuan Technology Co., Ltd
|
7.3mm 2W/MK Thermal Conductive Pad For LED Lighting , Non Silicone Gap Filler Pads
|
|
2.0W non silicone thermal interface conductive gap pad thermal gap filler LED Thermal Pad LED thermal pad is a high performance thermal conductive gap filling material, mainly used for thermal interface between electronic components and heat sink or ......
SZ PUFENG PACKING MATERIAL LIMITED
|
