pcfc190n65s3w wafer bare die

Brand Name:Hiner-pack

Model Number:HN2079

Place of Origin:Made In China

Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP). An anti-static tray is an ideal ...

Brand Name:PG

Place of Origin:China

Industrial SSD For Edge Computing 64GB 128GB 256GB Solid State Drive KIOXIA Wafer Good Die SSD Industrial Grade SATA 2.5'' SSD Specification Capacity 64GB / 128 / 256GB / 512GB / 1TB Interface SATA 2.5'' Protocol ...

Brand Name:G·T

Model Number:GTK-2412DC

Place of Origin:China

AC-DC power module 12V switch power board high power 12V8A switch power plate bare die Introduction of functions and parameters: This power supply has over current protection, overload protection and short circuit protection, AC85~265V wide ...

Place of Origin:China

Brand Name:ONSEMI

Model Number:PCFA86062

High Power MOSFET PCFA86062 Power MOSFET, N-Channel, 100 V, 1.8 mΩ, Bare Die [Who we are?] Sunbeam Electronics (Hong Kong) Co. Ltd is focus on semi-conductors sourcing and electronic components sale and service for clients over 10 years, specialize in ...

Brand Name:CXDLV

Model Number:D73F

Place of Origin:China

High Performance Wafer Type Butterfly Valve DN150 Large Diameter Bare Stem Shaft Specifications Applicable Standards: * Design and Manufacturing:GB/T12238-2005 * Connection:JB/T79-94(2) * Face to Face Dimension:GB/T12221(20) * Test and Inspection:JB/T9092-...

Brand Name:ZMSH

Place of Origin:China

...-Purity Semi-Insulating], and 6H-P type [P-type conductive]), with diameters ranging from 4-inch, 6-inch, 8-inch up to 12-inch. In addition to bare substrates, we

Brand Name:Suneast

Model Number:WBD2200 PLUS

Place of Origin:Shenzhen, Guangdong Province, China

...Wafers General type high-precision IC bonder, which is suitable for mass wafer loading products, SIP packaging, Memory Stack Die (memory stack), CMOS, MEMS and other processes. Features: Multilayer capability Automatic nozzle change Supermini chip placement Compatible with 8-12 inch wafers Ultrathin die...

Brand Name:PAM-XIAMEN

Place of Origin:China

...Wafer Substrate Thickness 290±20µm / Resistivity 0.008-0.025Ωcm , Epi Layer Thickness 10-15μm PAM-XIAMEN custom epitaxial or EPI wafer services on silicon wafers for research and development or mass production. PAM-XIAMEN processes single crystalline EPI layers on wafer diameters from 50mm to 150mm. Epitaxy is offered on bare wafers...

Brand Name:WZ

Model Number:WZ-GX01

Place of Origin:China

...Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Suitable for: SMD HIGH-POWER COB,part COM in-line package etc. 1,Full automatic up load and down load materials. 2,Module design,max optimization structure. 3,Full intellectual property right. 4,Picking die and Bonding die dual PR system. 5,Multi-wafer ring,dual glue ect configuration. Wafer Stage System The wafer...

Brand Name:ASM

Model Number:AD210 Plus

Place of Origin:China

...Die Bonding Machine ASM AD210 Plus Automatic Die Bonding System (6” wafer handling), Original and Used Die Bonding Machine Check out our best condition original and pre-owned ASM AD210 Plus Automatic Die Bonding System (6” wafer handling). Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM AD210 Plus Automatic Die

Brand Name:VERVO

Model Number:BV47F

Place of Origin:LISHUI,ZHEJIANG

Casting Steel Carbon Steel A216 WCB Bare Stem Butterfly Valve PN16 Dn250 Wafer Butterfly Valve 10 Butterfly Valve VERVO butterfly valves are offered in Triple Offset, Concentric Lining design in a wide ...

Brand Name:RUIHUI

Place of Origin:Guangdong, China (Mainland)

...wafer, and the professional wafer cutting production line is formed by automatically shifting the metal wafer to feed. For example, the equipment is used for rounding and misalignment. The left one is rounded and the right one is rounded. The machine has a

Brand Name:OEM/ODM

Model Number:Customized

Place of Origin:CHINA

...Wafer Coil Condenser For Marine Specification Product name HVAC Stainless Steel Fin Type Heat Exchanger Tube Wafer Coil Condenser For Marine Power 1/5HP, 1/4HP, 1/3HP, 3/8HP, 1/2HP, 3/4HP, 1HP, 1.5HP, 2HP,3HP, 4HP…20HP Materials Copper tube aluminum fin, galvanized plate Tube O.D. 7mm. 7.94mm, 9.52mm, 12.75mm, 15.88mm Aluminum fin Hydroponic fin or bare...

Brand Name:FUJI

Model Number:NXT-H A hybrid

Place of Origin:China

...NXT - H can at the same time corresponding to the wafer, plate loading and take charge. Simply replace the feed equipment, feeding way can completely change (mainly conveyor belt charging or mainly conveying plate loading, wafer). 2, high precision SMT On

Place of Origin:CHINA

...Wafer Blue Baby Feet Baby Shower Cupcake Party Toppers These lovely baby feet wafer toppers are ready to go on the cakes. They are made from edible wafer paper and printed with edible ink. We use wafer paper that is sourced and manufactured in Europe. Our wafer paper is made from the natural ingredients, potato starch, water and olive oil. It is suitable for vegetarians and vegans. 1. Features a. Easy to use preprint and die

Brand Name:ZG

Model Number:MS

Place of Origin:CHINA

Thermal Oxide Wafer, higher uniformity, and higher dielectric strength , excellent dielectric layer as an insulator Thermal oxide or silicon dioxide layer is formed on bare silicon surface at elevated temperature in the presence of an oxidant , the process...

Categories:Electronics Production Machinery

Country/Region:china

... leading dual die bonding, dual dispensing, and dual wafer search systems; ● Utilizes a direct-drive motor to drive the bonding head; ● Utilizes a linear motor to drive the wafer search platform (X/Y) and feed platform (B/C); ● Utilizes an automatic

Brand Name:Customized

Model Number:Die Cast Aluminum Parts with Anodizing

Place of Origin:China

Die Cast Aluminum Parts with Anodizing , Anodising Product Description Anodizing (also spelled anodising ) is an electrolytic passivation process used to increase the thickness of the natural oxide layer on the surface of Die Cast Aluminum Parts; Anodizing increases resistance to corrosion and wear, and provides better adhesion for paint primers and glues than bare metal does; Die...

Place of Origin:China

Brand Name:Sintec Optronics

Model Number:SBN Series

... Including wafer growth and slicing, fiber coupling and bar stacking laser. More than 1000 models are for your choice. Established in 2011, over 60 technicians and 2 scientists, ...

Brand Name:EMT

Place of Origin:CHINA

...Die Casting Inner Panel 800T Magnesium Alloy Aircraft Parts Magnesium alloy Aircraft parts Description: The benefits of high-performance aerospace magnesium alloys include reducing weight in fuselage structures, interior appliances and aero engine frames. Generally, most magnesium alloys have higher bare...