csp package substrate

Brand Name:Horexs

Place of Origin:CHINA

... by stacking several thin Chip vertically on the thin substrate with previous CSP mounting technology. CSP (Chip Size Package) CSP is to attach Chip to the laminated substrate with wire-bonding and encapsulate it by using plastic-type molding compound ,

Brand Name:China chao sheng

Model Number:2 layers of COF

Place of Origin:Shenzhen, Guangdong, China

2 layers of COF,electric annoyed liquid crystal drive,IC Package Substrate,palladium gold,ic package,pcb production Product Description Product area: electric annoyed liquid crystal drive Number of layers: 2 layers of COF ...

Brand Name:JIMA

Model Number:EDCU-HC

Place of Origin:china

...Package Substrates Specifications: AvailableThickness: 12 micron-70micron Available Width: 5-520 mm Available Length: 500-5000 M Coil ID: 76 mm,152 mm Purity:99.8% Mechanical features Various kinds of Thickness and Roughness. Low profile and good peel strength with resin. Good chemical resistance. Application: IC package substrates...

Brand Name:NEWFILM

Model Number:NF-019

Place of Origin:China, Guangzhou

... Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Item 25-Micron High-Gloss BOPP Thermally Reactive Dual-Adhesive Coating Film‌ ‌Jumbo-Roll 3600mm Precision-Grade Packaging Substrate Width 360-1920mm or custom Length 200-3600m or ...

Brand Name:TECircuit

Model Number:TEC0211

Place of Origin:China

Product Images About TECircuit Found: TECircuit has been operating since 2004. Location: An electronics manufacturing service(EMS) provider located in Shenzhen China. Item: Customizable EMS PCB, offers a full range of one-stop shop services. Service: ...

Brand Name:Bicheng Enterprise Limited

Model Number:BIC-0279-V2.79

Place of Origin:China

Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.12mm stainless steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated per IPC 7525A using supplied Gerber data, squeegee area ...

Brand Name:TYANSHINE

Model Number:TX-5266W250FC120-NUFENG-A01

Place of Origin:CN

... LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency...

Model Number:DM-CSP-SCS-1005A3-1.0W

...CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact luminous surface, ensuring excellent color consistency. Dimensions: Specification: Type CSP...

Brand Name:Lohua

Model Number:SL082011WF10030

Place of Origin:China

.... Regular size: 5m/coil. 3. Working Voltage: DC12V/24V, Working environment: －20℃～45℃. 4. The LED lamp bead is packaged in Lohua's patented product of high-brightness, high-effificiency CSP lamp bead package. 5.

Brand Name:Hiner-pack

Model Number:3 Inch Series

Place of Origin:Made In China

...CSP Chip Scale Package Transporting IC Factory Customized 3-Inch Anti-Static Tray To Load The Bar In Chip Level Package Hiner-pack supplies a wide range of Matrix trays and shipping IC trays for safely storing and transporting IC (Integrated Circuits), other components and modules. IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP...

Brand Name:SHENHUA

Model Number:SC810

Place of Origin:Guangdong, China

... spray cleaning machine for leadframe, IGBT, IPM,BGA, CSP package flux clean by using liquid wash and DI water rinse and hot air dry. For all kinds of flux and leadframe, IGBT, IPM,BGA, CSP package. SC810 working process: Pre-wash+Wash+ Chemical isolation...

Brand Name:wuxi special ceramic

Place of Origin:China

Widely Used In The Field Of Optical Communication Packaging Aluminum Nitride Ceramic Substrate Product Description: High Thermal Conductivity Ceramic Substrate for High-End Applications Product Name: Ceramics Substrate Use: HBLED, Opto-communication, IGBT...

Brand Name:Loranger

Model Number:Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets

...Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP...

Brand Name:Phenson

Model Number:PS-E9

Place of Origin:Guangzhou

...±0.3A Color 6000K pure white Working temperature -40-160℃ Lifespan >20000 hrs LED source 3570 CSP Packaging & Shipping - In order to protect the goods during transportation, carton and weaving bag are provided according to your requirement. -

Brand Name:LEARNEW

Model Number:4055 SERIES

Place of Origin:China

72-74V Dual Color COB LED Customized 300W 4055 Dual Color COB LED White 2600K+6500K COB LED CHIP Product Details Model POWER CCT LM/W IF VF WHOLE SIZE EMIT SIZE VIEW ANGLE CRI SUBSTRATE 4055 SERIES 300W+300WDual Color Temperature 2700K/6500K 90/120 3.9A ...

Brand Name:ZMSH

Place of Origin:China

Product Overview TGV (Through Glass Via) technology, also known as glass through-hole technology, is a vertical electrical interconnection technique that penetrates glass substrates. It enables vertical electrical connections on glass substrates, achieving...

Brand Name:UNICOMP

Model Number:AX9100

Place of Origin:China

...CSP LED AX9100 Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● 7 axis linkage, 70 degree tilt detection. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging

Place of Origin:China

...ch makes it ideal for use in optics and other applications where transparency is important. The Sapphire Substrate comes in a package of 25/cassette, making it easy to handle and store. The substrate features a sapphire template layer and is oriented along

Place of Origin:USA

...: Details Series: AD4032-24 Mounting Style: SMD/SMT Package / Case: CSP-BGA-64 Resolution: 24 bit Number of Channels: 1 Channel Interface Type: SPI Sampling Rate: 500 kS/s ...

Brand Name:Xilinx

Model Number:XC2C64A-7CPG56C

Place of Origin:USA

...7CPG56C Xilinx CPLD - Complex Programmable Logic Device CSP-56 Manufacturer: Xilinx Product Category: CPLD - Complex Programmable Logic Device Series: XC2C64A Installation style: SMD/SMT Package / Box: CSP-56 Operating supply voltage: 1.8 V Maximum number...