32mm Three Layer Stacked PCB Camera Module HDMI+3G-SDI SNQ-3581F-HDMI

The Lntech SNQ-3581F-HDMI is a high-end, feature-rich camera module designed for professional and broadcast-integration scenarios requiring direct video interface compatibility. It is based on a performance-optimized three-layer stacked circular PCB architecture (32mm diameter). At its core are the Sony IMX385 1/1.8-inch sensor for high-quality image capture and the EN781F digital signal processor, which provides 4K-level processing power for the module's 1080p60 output. Its defining feature is the inclusion of both HDMI (Version 1.4a) and 3G-SDI output interfaces, providing simultaneous connectivity for monitoring and recording in diverse professional environments. This module is suited for broadcast assist cameras, medical imaging, scientific equipment, and any application where direct digital output and superior image quality are required.

1. Professional Output Interface Configuration
The dual-output design caters to different professional workflows:

• HDMI 1.4a Interface: Provides a consumer-electronics-standard interface for easy connection to a vast array of monitors, projectors, and capture cards. Ideal for confidence monitoring, setup, and systems where cable length is not excessive.

• 3G-SDI Interface: Offers a broadcast-industry-standard connection. It is designed for long-distance transmission over coaxial cable (up to 100m+), features robust locking connectors, and is immune to many forms of electronic interference found in professional setups.

2. Three-Layer Stacked PCB Architecture
The 32mm three-layer stack is a sophisticated design choice:

• Component Segregation: Likely allocates one layer for the sensor and analog front-end, one for the main EN781F DSP and memory, and one for power regulation and output interfaces (HDMI, SDI).

• Enhanced Performance: This strict separation is highly effective at minimizing digital noise from affecting the analog sensor data and the critical clock signals for the digital outputs, ensuring a clean and stable video signal.

• Thermal Management: The stacked design aids in spreading heat generated by the DSP across a larger volume.

3. Synergy of 4K DSP and 1/1.8-inch Sensor
The EN781F DSP provides the necessary computational power to fully utilize the data from the IMX385 sensor. This combination enables advanced features like high-quality 3D-DNR, ACE (wide dynamic range), and Defog to run effectively, maximizing image quality in various lighting conditions.

4. Wide Operating Temperature Range
The -40°C to +80°C specification indicates the use of industrial-grade components and careful thermal design, making this module suitable for deployment in harsh environments, both indoors and outdoors.