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High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

Categories Thermal Gap Filler
Brand Name: ZIITEK
Model Number: TIF100-05S Series
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Products name: High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
Color: Blue
Keywords: Thermal Gap Filler
Sample: Sample free
Continuous Use Temp: -45 to 200℃
Hardness: 45 Shore 00
Thermal conductivity: 1.5W/m-K
Thickness: 0.020"(0.5mm)~0.200"(5.0mm)
Application: CPU Premium Insulation Element
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High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element

High Quality High Conductive Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element


The TIF®100-05S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features


> Good thermal conductive: 1.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized


Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU

> Display card
> Mainboard/mother board
> Notebook
> Power supply


Typical Properties of TIF®100-05S Series
PropertyValueTest method
ColorBlue******
Construction &CompostionCeramic filled silicone elastomer******
Thickness range0.020"(0.5mm)~0.200"(0.50mm)ASTM D374
Specific Gravity2.3g/ccASTM D297
Hardness45 Shore 00ASTM 2240
Continuos Use Temp-45 to 200℃******
Dielectric Breakdown Voltage> 5500 VACASTM D149
Dielectric Constant4.5 MHzASTM D150
Volume Resistivity1.0 X1012 Ohm-meterASTM D257
Flame rating94 V0UL E331100
Outgassing(TML)0.35%ASTM E595
Thermal conductivity1.5 W/m-KASTM D5470

Product Specification

Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied, Please contact us for comfirming.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Company profile


Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Independent R&D team


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