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| Categories | Double Sided PCB |
|---|---|
| Brand Name: | xingqiang |
| Model Number: | Varies by goods condition |
| Certification: | ROHS, CE |
| Place of Origin: | China |
| MOQ: | Sample,1 pc(5 square meters) |
| Price: | NA |
| Payment Terms: | ,T/T,Western Union |
| Supply Ability: | 3000 |
| Delivery Time: | 7-10 work days |
| Min. Solder Mask Clearance: | 0.1mm |
| Pcba Standard: | IPC-A-610E |
| Aspect Ratio: | 20:1 |
| Board Thinkness: | 1.2mm |
| Minimum Line Space: | 3mil (0.075mm) |
| Surface Finishing: | HASL/OSP/ENIG |
| Material: | FR4 |
| Product: | Print Circuit Board |
| Service: | OEM /ODM |
| Company Info. |
| Dongguan Xingqiang Circuit Board Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Double Sided Printed Circuit Board FR4 Material
Double-sided PCB, also known as double-sided printed circuit board, is a printed circuit board (PCB) with two-sided circuit connections. In this kind of PCB, the electronic components and circuit layout can be arranged on both sides of the PCB respectively, and the electrical connection of the circuits on both sides is achieved through vias (Vias). This structure greatly increases the functional density of the circuit board, allowing it to implement more circuit connections in a relatively small area.
Product Features:
1.Dual-Sided Copper Cladding
2.Plated Through-Holes (PTHs)
3.Balanced Performance-Cost
4.Moderate Component Density
5.Flexible Routing
6.Wider Application Adaptability
Advantages of Double-sided PCB:
1.Component Density:Accommodates 2-3 times more components (e.g., SMDs, through-hole parts) compared to single-sided PCBs, thanks to dual copper layers for component mounting and routing.
2.Routing Flexibility:Reduces wire crossing and signal interference by utilizing both top and bottom layers. Enables simpler layout of complex circuits (e.g., mixed signal/power circuits) via Plated Through-Holes (PTHs).
3.Space Efficiency:Saves board area significantly. Critical for compact devices (e.g., smartphones, wearables) where miniaturization is a priority.
4.Performance Balance:Supports moderate signal frequencies and current loads. Suitable for most consumer, industrial, and automotive electronics that don’t require the high-density or high-frequency capabilities of multi-layer PCBs.
5.Manufacturing Simplicity:Less complex than multi-layer PCBs (fewer lamination and drilling steps). Faster production turnaround and lower defect rates in manufacturing.
Manufacturing process:
• Substrate :PreparationThe foundation for all subsequent processes. Uncut or
contaminated substrates fail to ensure stable copper adhesion,
compromising circuit integrity.
• Copper :CladdingEssential to form conductive layers on both sides. Without
copper cladding on both surfaces, the core advantage of "dual-layer
routing" is lost.
• Drilling:Required to create holes for through-hole components and as a base
for interlayer connections. No drilling means no way to mount
components or enable layer-to-layer conduction.
• PTH Metallization:The defining step for double-sided PCBs. Copper plating inside
drilled holes is mandatory to electrically connect top and bottom
copper layers; without it, the two layers remain isolated and
non-functional.
• Circuit Pattern Transfer & Etching:These two steps work together to define the circuit layout. Pattern
transfer marks the desired copper areas, while etching removes
excess copper—both are necessary to form the designed conductive
paths.
• Solder Mask Application:Critical for insulating copper traces, preventing oxidation, and
avoiding short circuits during soldering. PCBs without solder mask
are prone to failures in assembly and operation.
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