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OSP Surface 2 Layer Flexible PCB Board Customized Size for Medical Equipment

Categories Flexible PCB Board
Brand Name: Flexible PCB Board
Place Of Origin: China
Delivery Time: 15-16 work days
Payment Terms: T/T,Western Union
Supply Ability: 3000㎡
Model Number: Varies by goods condition
Certification: ROSE, CE
MOQ: Sample,1 pc(5 square meters)
Price: NA
Legend Color: White
Size: customized
Board Type: Flexiable PCB
Surface Treatment: OSP
Flexibility: Highly Flexible
Mini Line Width: 0.075mm
Standard: IPC Standard
Substrate: FR4
Oil Layer Color: Black
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OSP Surface 2 Layer Flexible PCB Board Customized Size for Medical Equipment

2 Layers Flexible Printed Circuit Board (FPC) for Medical Enquipment

A Flexible Printed Circuit Board (FPC), also known as a flexible circuit, is a specialized type of printed circuit board constructed from flexible, bendable insulating substrates. Unlike rigid PCBs (RPCBs) that rely on inflexible materials like fiberglass-reinforced epoxy (FR-4), FPCs leverage malleable substrates to enable dynamic shaping, folding, or rolling—making them ideal for electronic devices where space constraints, weight reduction, or mechanical flexibility are critical.

Features:

  • Product Name: Flexible PCB Board
  • Size: Customized
  • Application: Electronic Devices, Medical Equipment, Automotive Industry
  • Mini Line Width: 0.075mm
  • Standard: IPC Standard
  • Layer Count: 2-30 layer

Technical Parameters:

Technical ParameterSpecification
Dimensioncustomized
Insulation MaterialsOrganic Resin
Board TypeFlexiable PCB
ServiceOne Stop Turnkey Service
FlexibilityHighly Flexible
ApplicationElectronic Devices, Medical Equipment, Automotive Industry
Mini Line Width0.075mm
Surface TreatmentOSP
ProcessImmersion Gold
Legend ColorWhite

Applications:

  • Consumer Electronics:Smartphones (display/touchscreen connections, camera modules), tablets, laptops (keyboard/trackpad links), smartwatches, earbuds, and gaming controllers.
  • Automotive Electronics:Infotainment systems, dashboard displays, LED lighting, sensor connections (e.g., for ADAS—Advanced Driver Assistance Systems), and battery management systems (BMS).
  • Medical Devices:Flexible endoscopes, wearable health monitors (e.g., heart rate sensors), implantable devices (e.g., pacemakers), and diagnostic equipment (e.g., ultrasound probes).
  • Aerospace & Defense:Satellite components, avionics (e.g., cockpit displays), and military gear (where vibration resistance and compactness are critical).
  • Industrial Equipment:Robotic arms (flexible connections for moving parts), industrial sensors, and control panels.

Future Trends
High-Density Interconnects (HDIs):Smaller vias and finer trace widths (down to 25μm) to support more complex circuits in tiny spaces.
• Eco-Friendly Materials:Development of recyclable or biodegradable substrates to reduce environmental impact.
• Integration with Sensors:Embedding flexible sensors (e.g., pressure, temperature) directly into FPCs for smart textiles, medical wearables, and IoT devices.
• 5G & High-Speed Signals:Optimized FPC designs to minimize signal loss for 5G-enabled devices and high-frequency applications (e.g., radar systems).
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