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High-Performance 6-Layer PCB with RO4003C and FR-4 Hybrid Construction

Categories Multi Layer PCB
Brand Name: Bicheng
Certification: UL, ISO9001, IATF16949
Place of Origin: China
MOQ: 1PCS
Price: USD9.99-99.99/PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
PCB material: Rogers RO4003C (high-frequency laminate) + Tg170 FR-4 (standard laminate)
Layer count: 6-layer
PCB thickness: 6.8mm
PCB size: 495mm × 345mm, with a tolerance of ±0.15mm
Copper weight: 1oz (35μm) on all layers
Surface finish: Immersion Gold (ENIG)
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High-Performance 6-Layer PCB with RO4003C and FR-4 Hybrid Construction

This advanced 6-layer rigid PCB is designed for high-frequency and high-reliability applications, combining Rogers RO4003C and Tg170 FR-4 materials for optimal electrical and mechanical performance. The board features a hybrid stack-up to balance cost, manufacturability, and signal integrity, making it ideal for RF and microwave applications.


Specification CategoryDetails
Base MaterialsRogers RO4003C (high-frequency laminate) + Tg170 FR-4 (standard laminate)
Board Dimensions495mm × 345mm, with a tolerance of ±0.15mm
Layer Count6 layers
Finished Thickness6.8mm
Copper Weight1oz (35μm) on all layers
Minimum Trace/Space5 mils (trace) / 6 mils (space)
Minimum Hole Size0.8mm
Via Plating Thickness20μm
Surface FinishImmersion Gold (ENIG)
Blind/Buried ViasNone
Solder Mask & SilkscreenNone
Depth-Controlled SlotsYes (present on top and bottom layers)
Electrical Testing100% tested before shipment

PCB Stack-up Details

The stack-up is meticulously optimized to enhance signal integrity and thermal stability:

LayerMaterialThickness
Copper (L1)35μm (1oz)-
CoreTg170 FR-43.0mm
Copper (L2)35μm (1oz)-
Bonding PlyPrepreg (4mil)0.102mm
Copper (L3)35μm (1oz)-
CoreRogers RO4003C (12mil)0.305mm
Copper (L4)35μm (1oz)-
Bonding PlyPrepreg (4mil)0.102mm
Copper (L5)35μm (1oz)-
CoreTg170 FR-43.0mm
Copper (L6)35μm (1oz)-

Introduction to Rogers RO4003C Material


Rogers RO4003C is a high-frequency laminate that merges the electrical performance of PTFE/woven glass with the fabrication simplicity of epoxy/glass. It stands out in RF and microwave applications due to its tight dielectric constant control and low dissipation factor.


Key Features of Rogers RO4003C

1. Stable Dielectric Constant (Dk): Maintains a consistent 3.38 ±0.05 at 10GHz, ensuring reliable signal propagation in high-frequency designs.


2. Low Dissipation Factor (Df): Measures 0.0027 at 10GHz and 0.0021 at 2.5GHz, minimizing signal loss even in high-speed applications.


3. Effective Thermal Conductivity: 0.71 W/m/°K, facilitating efficient heat dissipation from active components.


4. Minimal Moisture Absorption: Only 0.06%, preserving electrical performance in humid environments.

Strong CTE Compatibility with Copper:

X-axis: 11 ppm/°C

Y-axis: 14 ppm/°C

Z-axis: 46 ppm/°C


This reduces stress between layers during thermal cycling, enhancing long-term reliability.


5. High Glass Transition Temperature (Tg >280°C): Ensures stability under extreme thermal stress, critical for rugged operating conditions.


Advantages of Using RO4003C

1. Ideal for Multi-Layer RF/Microwave PCBs: Balances high-frequency performance with the structural needs of complex layer stacks.


2. FR-4 Compatible Processing: Eliminates the need for specialized manufacturing techniques, lowering production costs and simplifying fabrication.


3. Enhanced Signal Integrity: Low Dk variation and minimal loss make it perfect for high-frequency signals (e.g., RF, microwave), reducing distortion and ensuring data accuracy.


4. Durable Plated Through-Holes (PTH): Maintains integrity even under thermal shock, a key requirement for reliable interconnects in demanding applications.


Typical Applications

This PCB is ideally suited for:


Cellular Base Station Antennas & Power Amplifiers

RF Identification (RFID) Tags

Automotive Radar & Sensors

Low-Noise Block (LNB) for Satellite Communications

High-Speed Digital & Mixed-Signal Designs


Conclusion

This 6-layer hybrid PCB harnesses the high-frequency capabilities of Rogers RO4003C and the structural robustness of Tg170 FR-4, resulting in a cost-effective yet high-performance solution for demanding RF and microwave applications.


Available worldwide, this PCB is an excellent option for engineers seeking a balance between performance, manufacturability, and cost.


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