Low-Temperature Cure Platinum Catalyst – Fast Crosslinking for Thermal Potting & Gel Systems

Low-Temperature Cure Platinum Catalyst – Fast Crosslinking for Thermal Potting & Gel Systems

Product Overview for Platinum Catalyst

This versatile low-temperature cure platinum catalyst enables efficient crosslinking even below 50°C, making it perfect for heat-sensitive components, thick potting sections, and gel systems where fast gelation and low exotherm are needed.

Product Features for Platinum Catalyst

• Cures rapidly at 25–60°C

• Low exotherm ideal for deep potting

• Excellent penetration into dense assemblies

Product Parameters for Platinum Catalyst

• Platinum content: 3500–5000 ppm

• Gel time @ 40°C: 5–15 minutes

• Max exotherm rise: < 20°C above ambient

Applications for Platinum Catalyst

Thermal potting gels for electronics

Silicone gels for medical cushioning

Low-temperature molding compounds

Encapsulation of heat-sensitive sensors

Operating Guidelines for Platinum Catalyst

Dosage: 0.1–0.7% in silicone base

Mix thoroughly, degas if needed

Cure: 40–80°C for 1–3 hours

Precautions for Platinum Catalyst

Do not exceed recommended thickness without testing

Avoid exposure to acidic or basic contaminants

Packaging & Storage for Platinum Catalyst

250 g, 1 kg, 5 kg plastic or glass containers

Store at 15–25°C

FAQ for Platinum Catalyst

What is the minimum cure temperature?

Can cure at room temperature (25°C), though 40–60°C is recommended for faster cycles.

Is it suitable for potting lithium-ion batteries?

Yes, its low exotherm and good thermal conductivity make it ideal.

Can it be used with automatic dispensing equipment?

Yes, it has stable viscosity and good flow properties.

What is the dielectric strength after cure?

Typically >20 kV/mm.

Does it adhere to PCB substrates?

Adhesion is good to most substrates, but a primer may be needed for non-silicones.