Durable Carbon Reinforced Conductive Waffle Pack Trays For
Automated Tool Handling
The waffle pack chip tray is engineered with a core focus on
extreme durability, resistance to handling stress, and
compatibility with automated tool interfaces. Recognizing that
trays in high-volume production cycles face repeated loading,
unloading, and shipping, this product integrates advanced materials
to ensure maximum lifespan and minimal process interruption. The
tray is molded using a high-quality, carbon-fiber reinforced
conductive polymer. The carbon reinforcement is not merely for ESD;
it provides extraordinary mechanical strength and anti-warping
characteristics, guaranteeing that the tray maintains its critical
flatness and dimensional alignment throughout its service life,
even under rough handling or high stacking loads. Available in both
the standard 2×2 and 4×4 inch formats, the tray's permanent
ESD-safe properties ensure that sensitive microelectronic devices,
such as bare die, COG (Chip-on-Glass), and CSPs, are consistently
protected from static discharge.
Features:
- Carbon-Fiber Reinforced Strength
- Permanent ESD Safety
- Optimized for Tool Interface
- High Stacking and Shipping Security
- Versatile Material Options (ABS/PC)
Technical Parameters:
| HN24236 Technical Data Ref. |
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| PC | Black | 30*30=900PCS | 1.96*1.38*0.45mm |
| Size | Length * Width * Height (according to customer's requirement) |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. Free Samples – Selected from e×isting products. |
| B. Customized Samples – Produced according to your design or
requirements. |
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format | PDF,2D,3D |
Applications:
This ultra-durable waffle pack excels in high-throughput,
high-stress microelectronic environments. Its key applications are
concentrated where mechanical robustness and reliable automation
interface are paramount. These include: High-Volume Bare Die
Sorting and Kitting, where the trays are repeatedly loaded and fed
into automated handlers; Secure Overseas Transport, utilizing the
carbon-fiber strength to withstand stacking pressures and rough
handling during shipping; Packaging for Large COG Devices,
providing stable support for physically larger components; and
Manufacturing Test Lines, ensuring consistent alignment for
electrical probe testing and visual inspection. While often used
for semiconductors, its reliable operation and superior device
protection extend its use to other industries managing small,
high-value inventory, such as high-precision medical parts or
specialized watch mechanisms, providing a reliable method for
inventory management and safeguarding during transit.
Customization:
Customization services focus heavily on reinforcing durability and
optimizing the tray for your specific automated process. We offer:
Enhanced Pocket Geometry, where the pocket walls can be thickened
or reinforced at critical stress points, or feature specific
clearance cuts to improve automated tool suction and release;
Material Specificity, allowing the choice of specific polymer
grades for enhanced impact resistance or chemical compatibility;
Custom Marking, fiducial marks to aid machine vision and inventory
tracking; and Bakeable Versions, for customers whose durable trays
must also withstand thermal processing up to 180°C.