Standing wave ratio: 1.2~1.3
Withstand voltage: 500V/1 mm (Substrate thickness)
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| Categories | RF Resistor |
|---|---|
| Place of Origin: | Sichuan, China |
| Brand Name: | BONENS |
| Model Number: | RIG |
| MOQ: | 1 |
| Resistance: | 100Ω |
| Resistance Tolerance: | ±5%, ±2%,±5% |
| Operating Temperature: | -55°C~+125°C |
| Temperature Coefficient: | ±300*10-6/℃ |
| Power: | 1000W |
| Rated Power: | 1000W |
| Nominal Resistance Range: | 1Ω-500Ω |
| Frequency Range: | 0~2GHz |
| Standing Wave Ratio: | 1.2~1.3 |
| Insulation Resistance: | ≥ 1GΩ |
| Withstand Voltage: | 500V/1 mm |
| Terminal Strength: | 10N,5S |
| Solderability: | 240℃,3s |
| Temperature Shock: | ΔR≤±5%R |
| Vibration Resistance: | ΔR≤±3%R |
| Company Info. |
| Sichuan Qixing Electronics Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Rated power | 1-1200W (70°C) | ||||
Temperature range | -55°C~+165°C | ||||
TCR | ≤±200PPM/°C | ||||
Temperature shock (-55°C/+125°C, 3 times) | ΔR≤±5%R | ||||
Moisture proof (GJB306A-96-Method106) | ΔR≤±5%R | ||||
Vibration (10-500HZ, 0.75mm, 6h) | ΔR≤±3%R, No mechanical damage | ||||
Test at low temperature (-55°C, 24h) | ΔR≤±5%R | ||||
Load life (96) | ΔR≤±5% | ||||
Collision | ΔR≤±3%R | ||||
Electrical Characteristics | ||||||
Range of nominal resistance | 1Ω~500Ω | |||||
Resistance tolerance | ±5% | |||||
Frequency range | 0~1GHz | |||||
Standing wave ratio | 1.2~1.3 | |||||
Insulation resistance | ≥ 1GΩ | |||||
Withstand voltage | 500V/1 mm (Substrate thickness) | |||||
Environment Characteristics | ||||||
Rated power | 800W (70°C) | |||||
Temperature range | -55°C~+165°C | |||||
TCR | ≤±200PPM/°C | |||||
Temperature shock (-55°C/+125°C, 3 times) | ΔR≤±5%R | |||||
Moisture proof (GJB306A-96-Method106) | ΔR≤±5%R | |||||
Vibration (10-500HZ, 0.75mm, 6h) | ΔR≤±3%R, No mechanical damage | |||||
Test at low temperature (-55°C, 24h) | ΔR≤±5%R | |||||
Load life (96) | ΔR≤±5% | |||||
Collision | ΔR≤±3%R | |||||
Physical Characteristics | ||||||
Terminal strength(10N,5S) | No loose and fall off | |||||
Solderability(240℃,3s) | Tin layer covering area of 95% | |||||
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