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22 KV/Mm Epoxy Potting Compound Glue Potting For Capacitors, Transformers, Sensors, LED Modules Electronic Potting Silicone Rubber

Categories Epoxy Potting Compound
Brand Name: Hanast
Model Number: HN-5508
Certification: ROHS
Place of Origin: Guangdong,China
MOQ: 1kg
Price: USD
Payment Terms: D/A, D/P, T/T
Delivery Time: 5-8 days
Packaging Details: 25kg/barrel
Name: black potting epoxy
The Mixing Ratio: A:B=5:1
Thermal Conductivity: 0.2 W/mK
Color: Transparent,black
Application: PCB/Battery/LED
Customized: Support
Hardness: Shore D 80
Feature: flame retardant insulation, sealing bonding, moisture-proof
Curing time: 25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
distortion temperature ℃: 130-150
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22 KV/Mm Epoxy Potting Compound Glue Potting For Capacitors, Transformers, Sensors, LED Modules Electronic Potting Silicone Rubber

22 KV/Mm Epoxy Potting Compound Glue Potting For Capacitors, Transformers, Sensors, LED Modules Electronic Potting Silicone Rubber

Product description:

Epoxy resin potting compound is a thermosetting encapsulating material based on epoxy resin. Through mixing with a curing agent, it reacts to form a robust and durable insulator, commonly used for insulation, moisture protection, dustproofing, waterproofing, and fixing of electronic components. It comes in two types: two-component room-temperature curing and one-component high-temperature curing. It possesses excellent insulation properties, chemical resistance, high mechanical strength, and adhesion.

Application:

Main Applications:

Electronic Component Packaging: Providing insulation and physical protection for components such as capacitors, transformers, sensors, and LED modules.

Circuit Board Protection: Used for the confidentiality, insulation, and moisture protection of circuit boards.

Automotive, Aerospace, and Other Fields: Used in electronic products requiring high strength and resistance to harsh environments.


Before curingbuilderEpoxy resin 5508Curing agent 5508
pigmentBlack / White et alRuburn / transparent surface
A sticky epoxy resin waterr liquid specific
c gravity, g / cm31.4-1.51.05
Viscosity of 25℃4,500—6,000cp s150—250cp storage
e Period (25℃)Six monthsx months

processabili


mixing ratioA: B =5:1 (weight ratio)
Available for a time of 25℃2-3H (100g mix)
curing time25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H
After curing2 Tensile strength of kg/cm16-18
2 Compressive strength of kg/cm18-22
Resistance to the voltage of kv/mm20-22
Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage%0.35-0.55
Water absorption rate was 25℃ * 24H<0.03%

The hardness of SHORE A85-95

distortion

temperature ℃

130-150
low temperature resistant ℃

-30


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