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UL2651 Flat Cable with IDC Connector 8 10 20 30 34 36 40 64 Pin Ribbon IDC Cable

Categories Flat Cable
Brand Name: HONSHI
Model Number: B2410BA500B02
Certification: ISO9001/ISO14001/ROSH/Reach
Place of Origin: China
MOQ: 100 pieces
Price: $0.10 - $0.65/pieces
Payment Terms: T/T,Paypal
Supply Ability: 500000kpcs
Delivery Time: 7-10 Day
Packaging Details: Tray/Pe bag
Application: Automobile
Product name: Flat cable
Pitch: 1.27/2.0mm/2.54mm
Reference standard: UL2651
Length: 10cm/25cm/30cm/45cm/50cm/100cm
Conductor Material: Tinned copper wire
Insulation Material: PVC Polyester
MOQ: Small MOQ and trial order are welcome.
Service: OEM ODM Accept
Color: Red
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UL2651 Flat Cable with IDC Connector 8 10 20 30 34 36 40 64 Pin Ribbon IDC Cable

Customized 10 Way 2.54mm Pitch Micro-MaTch IDC to IDC 10 Ways Flat Ribbon Cable Micro-Match Wiring Harness


Specific material electrical parameters
IDC Connector Specifications:Wire specifications:
Rated Current:3.0AMPInsulator Material:PVC
Contact Resistance:20mΩ MaxConductor:7/0.127mm(Tin Plated Copper)
Withstand Voltage:500V AC/DCCable Color:Wires Red Marking Grey Side
Insulation Resistance:1000MΩ MinCable LengthBe Customized
Operation Temperature:-40°c to +105°cCable Testing:
Connector:IDC SocketContact Resistance:3Ω Max.
Pitch:1.27/2.54mmInsulation Resistance:10MΩ Min.
Positions:4P~24PWithstand Voltage:DC300V, 5second
Contact Material:Brass100% Open & Short Test
Contact Plating:Au or Sn Over NiAll materials comply with"ROHS" environmental protection standards
Insulator Material:PBT(UL94V-0)

2.0mm 40 Pin IDC Flat Ribbon Cable Assembly With Tinned Copper Wire Conductor 1


Item name: Flat Cable


Gray wire harness has a small volume and light weight, and the original design of the wire harness board was to replace larger wire harness wires. Gray wire is usually the only solution to meet miniaturization and mobility requirements on current plug-in electronic component assembly boards. Gray wire is a process of etching copper circuits or printing thick film polymer circuits onto a polymer substrate. For devices that are both thin and lightweight, with compact and complex structures, their design and processing plans include from single-sided conductive lines to complex multi-layer three-dimensional assembly.


Management Concept
Responsibility Innovation Integrity Win-Win;

Team Culture
Thanksgiving Valute Respects Team efforts;

Service Purpose
Quality fisrt Customer Satisfaction Professinal Improving;

Sustainable Manner
HONSHI grow in a sustainable manner,to support our valued customers with flexibly customized interconnect solutions.

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