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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

Categories Epoxy Potting Compound
Brand Name: Hanast
Model Number: HN-5508AB
Certification: ROHS SGS
Place of Origin: Guangdong,China
MOQ: 1kg
Payment Terms: T/T
Packaging Details: 25kgs/barrel
Price: Negotiable
Feature: flame retardant insulation, sealing bonding, moisture-proof
Waterproof: Yes
Consist: Epoxy resin A, Curing agent B
Hardness shore A: 85-95
Viscosity: Low Viscosity
Appearance: A sticky epoxy resin water,liquid
mixing ratio: A: B =5:1 (weight ratio)
Water absorption rate was 25℃ * 24H: <0.03%
low temperature resistant ℃: -30
Shelf time: 6 months (25℃)
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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors

85 Hardness Silicone For Encapsulation Connectors 5:1 Epoxy Potting Glue Black Color For Transformer Resistors 2 Components Potting Compound Material


Product descriptions:

HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product


Product features:

Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation

Before curing

builder

Epoxy resin 5508

Curing agent 5508

pigment

Black / White et al

Ruburn / transparent surface

A sticky epoxy resin water

r liquid specific

c gravity, g / cm3

1.4-1.5

1.05

Viscosity of 25℃

4,500—6,000cp s

150—250cp storage

e Period (25℃)

Six months

x months


processabili


mixing ratio

A: B =5:1 (weight ratio)

Available for a time of 25℃

2-3H (100g mix)

curing time

25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

After curing

2 Tensile strength of kg/cm

16-18

2 Compressive strength of kg/cm

18-22

Resistance to the voltage of kv/mm

20-22

Surface resistance ofΩ-cm

14

1.2*10

Volume resistance ofΩ-cm

15

1.1*10

contraction percentage%

0.35-0.55

Water absorption rate was 25℃ * 24H

<0.03%


The hardness of SHORE A

85-95

distortion

temperature ℃

130-150

low temperature resistant ℃

-30

Application:

HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers

Quality Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors wholesale
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