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High Precision MEMS Gyroscope Chip with 0.05°/h Bias Instability for IMU Accelerometer Gyro

Categories IMU Accelerometer Gyro
Brand Name: Firepower
Model Number: MGZ332HC-P5
Place of Origin: CHINA
MOQ: 1
Payment Terms: L/C,T/T
Supply Ability: 500pcs
Delivery Time: 1 week
Packaging Details: Wooden box
Certification: CE
Product Name: MEMS Gyroscope Chip
Bias Instability: 0.05°/h
Bias stability @10s: <0.5°/h
(Bias stability @1s: <1.5°/h
Angular Random Walk: <0.025°/ √h
Bias error over temperature: <5°/h
VRE: <1°/hr/g
Data Rate: 12K
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High Precision MEMS Gyroscope Chip with 0.05°/h Bias Instability for IMU Accelerometer Gyro

High Precision MEMS Gyroscope Chip with 0.05°/h Bias Instability for IMU Accelerometer Gyro


Product Description


MEMS Gyroscope Chip is a miniature solid-state angular rate sensor designed for accurate measurement of rotational velocity.It adopts advanced MEMS micromachining technology and closed-loop drive architecture to achieve high precision, low bias instability, and excellent vibration resistance.The chip delivers digital output through SPI or UART interface and is fully temperature compensated, ensuring consistent performance in dynamic environments.It is widely used in UAVs, robotics, vehicle stabilization systems, and tactical-grade inertial navigation units.


Main Paremeters

performance
MGZ332HC-P1MGZ332HC-P5MGZ318HC-A1MGZ221HC-A4MGZ330HC-O1MGZ330HC-A1
Rangedeg/s400400400400400100
Band Width @3DB customized)Hz9018020020030050
Output accuracy(digital SPI)bits242424242424
Output rate(ODR)(customized)Hz12K12K12K12K12K12K
Delay(customized)ms<3<1.5<1.5<1.5<1<6
Bias stabilitydeg/hr(1o)<0.05<0.05<0.1<0.5<0.1<0.02
Bias stability (1σ 10s)deg/hr(1o)<0.5<0.5<1<5<1<0.1
Bias stability (1σ 1s)deg/hr(1o)<1.5<1.5<3<15<3<0.3
Bias error over temperature (1σ)deg/hr(1o)<5<5<10<30105
Bias temperature variations, calibrated(1σ)deg/hr(1o)<0.5<0.5<1<10<1<0.5
Bias repeatabilitydeg/hr(1o)<0.5<0.5<0.5<3<0.3<0.1
Scale factor at 25°Clsb/deg/s200002000016000160002000080000
Scale factor repeatability (1σ)ppm(1o)<20ppm<20ppm<20ppm<20ppm<100ppm<100ppm
Scale factor vs temperature (1σ)ppm(1o)100ppm100ppm<100ppm<100ppm<300ppm<300ppm
Scale factor non-linearity (1σ)ppm100ppm100ppm<150ppm<150ppm<300ppm<300ppm
Angular random walk(ARW)°/√h<0.025<0.025<0.05<0.25<0.05<0.005
Noise(Peak to Peak)deg/s<0.15<0.3<0.35<0.4<0.25<0.015
GValue sensitivity°/hr/g<1<1<1<3<1<1
Vibration rectification error(12gRMS,20-2000)°/hr/g(rms)<1<1<1<3<1<1
Environmental suitability
Impact (power on)500g , 1ms
Impact resistance (power off)10000g , 10ms
vibration(power on)18g rms (20Hz to 2kHz)
Working temperature-40ºC----+85ºC
Store temperature-55ºC----+125ºC
Supply voltage5±0.25V
Current consumption45ma



PCB Design

The decoupling capacitors for pins VCP, VREF, VBUF, and VREG should be placed as close to the pins as possible, and the equivalent resistance of the traces should be minimized. The other ends of the decoupling capacitors for VREF, VBUF, and VREG are connected to the nearest AVSS _ LN and then to signal ground via a magnetic bead. The decoupling capacitors for VCC and VIO are also placed close to the corresponding pins. When VCC is in normal operation, the overall current will be about 35 mA, which requires a wide PCB trace to ensure voltage stability. For smooth assembly of the device, try to avoid routing under the package. Locate components to avoid areas of stress concentration. It is necessary to avoid large heat dissipation elements and areas with external mechanical contact, extrusion and pulling, as well as areas where positioning screws are prone to warping during overall installation.


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