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| Categories | Thermal Gap Pad |
|---|---|
| Brand Name: | ZIITEK |
| Model Number: | TIF1160-30-05US |
| Certification: | UL and RoHs |
| Place of Origin: | China |
| MOQ: | 1000pcs |
| Price: | negotiation |
| Supply Ability: | 100000pcs/day |
| Delivery Time: | 3-5 work days |
| Packaging Details: | 1000pcs/bag |
| Products name: | RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU |
| Thickness: | 4.0mmT |
| Outgasing (TML): | 0.35% |
| Thermal conductivety: | 3.0W/mK |
| Operating Temp: | -40 to 160℃ |
| Dielectric Breakdown Voltage: | 94 V0 |
| Volume Resistivity: | 1.0X10¹² Ohm-cm |
| Company Info. |
| Dongguan Ziitek Electronic Materials & Technology Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU
TIF1160-30-05US Series thermally conductive interface materials areapplied to fill the air gaps between the heating elements and the heatdissipation fins or the metal base.Their flexibility and elasticity make themsuited to coat very uneven surfaces. Heat can transmit to the metalhousing or dissipation plate from the heating elements or even the entirePCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
TIF100-30-05US-Series-Datasheet.pdf
Features
> Good thermal conductive: 3.0 W/mK
> Thickness:4.0mmT
> Hardness:18 shore 00
> UL recognized & RoHS Compliance
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness
Applications
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF1160-30-05US Series | ||||
Color | blue | Visual | Composite Thickness | Thermal Impedance@10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific gravity | 3.0g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
| Thickness | 4.0mmT | *** | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 18 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
| Outgasing (TML) | 0.35% | ASTM E595 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 1.0X1012 Ohm-cm | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 3.0 W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
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