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TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

Categories Impedance Controlled PCB
Brand Name: Bicheng
Model Number: BIC-509.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Material: TU-883
Layer count: 20 layers
PCB thickness: 3.0mm
Solder mask: Green
Silkscreen: White
Surface finish: Immersion gold
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TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled


TU-883 Multi-layer Printed Circuit Board (PCB) HDI Low Loss High Temperature PCB With 90 Ohm Impedance Controlled

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


Brief Introduction

This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.


Applications

Radio frequency

Backplane, High performance computing

Line cards, Storage

Servers, Telecom, Base station, Office Routers



Detailed Specifications

ItemDescriptionActualResult
1. LaminateMaterial TypeTU-883ACC
Tg170℃ACC
SupplierTUCACC
Thickness2.8-3.1mmACC
2.Plating thicknessHole Wall26.51µmACC
Outer copper41.09µmACC
Inner Copper15µm / 31µmACC
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600DACC
ColorGreenACC
Rigidity (Pencil Test)5HACC
S/M Thickness20.11µmACC
LocationBoth SidesACC
4. Component MarkMaterial TypeIJR-4000 MW300ACC
ColorWhiteACC
LocationC/S, S/SACC
5. Peelable Solder MaskMaterial Type/
Thickness/
Location/
6. IdentificationUL MarkYESACC
Date Code2921ACC
Mark LocationSolder SideACC
7. Surface FinishMethodImmersion GoldACC
Nickel Thickness4.06µmACC
Gold Thickness0.056µmACC
8. NormativenessRoHSDirective 2015/863/EUACC
REACHDirective 1907 /2006ACC
9.Annular RingMin. Line Width (mil)4.8milACC
Min. Spacing (mil)5.2milACC
10.V-grooveAngle/
Residual thickness/
11. BevelingAngle/
Height/
12. FunctionElectrical Test100% PASSACC
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2ACC
Visual InspectionIPC-A-600J &6012D Class 2ACC
Warp and Twist0.21%ACC
14. Reliability TestTape TestNo PeelingACC
Solvent TestNo PeelingACC
Solderability Test265 ±5℃ACC
Thermal Stress Test288 ±5℃ACC
Ionic Contamination Test0.56µg/c㎡ACC

Stackup & Impedance Controlled


HDI vias



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