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RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish

Categories Taconic PCB
Brand Name: Bicheng
Model Number: BIC-166.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: PTFE based, ceramic filled fiberglass
Layer count: Double Layer, Multilayer, Hybrid PCB
PCB thmil (0.762mm), 60mil (1.524mm)ickness: 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Copper weight: 0.5oz (17 µm), 1oz (35µm)
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..
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RF-60TC PTFE Based 60mil Coating RF Circuit Board Hasl Surface Finish


RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. By improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications


RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.


RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.


Our PCB Capability (RF-60TC)

PCB Material:PTFE based, ceramic filled fiberglass
Designation:RF-60TC
Dielectric constant:6.15
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm)
PCB thickness:10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm)
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

Benefits:

  • Maximized Signal Integrity: Features an improved loss tangent and a stable DK to minimize signal loss and boost antenna gain across a wide range of frequencies and operating temperatures.

  • Effective Heat Dissipation: High thermal conductivity manages heat effectively, allowing for higher power handling, cooler component operation, and enhanced product longevity.

  • Proven Structural Reliability: Exceptional dimensional stability and a low Z-axis CTE ensure robust performance in multilayer applications, providing reliable plated through-holes (PTHs) even under thermal stress.

  • Superior Copper Bonding: Offers excellent adhesion to metal, enabling the use of lower profile copper for fine-line patterning and heavy metal backs for thermal or structural support.

  • Resistant to Environmental Factors: Low moisture absorption maintains stable performance in humid conditions.



Applications:

High power amplifier

Miniaturized antennas (GPS / PATCH / RFID Reader)

Filters, couplers, dividers

Satellites


Typical Value of RF-60TC

RF-60TC Typical Values
PropertyTest MethodUnitValueUnitValue
Dk @ 10 GHzIPC-650 2.5.5.5.1 (Modified)6.15 ± 0.156.15 ± 0.15
Df @ 10 GHzIPC-650 2.5.5.5.1 (Modified)0.0020.002
TcKppm/°C-3.581ppm/°C-3.581
Dielectric BreakdownIPC-650 2.5.6kV55kV55
Dielectric StrengthIPC-650 2.5.6.2V/mil550V/mm21,654
Arc ResistanceIPC-650 2.5.1Seconds>180Seconds>180
Moisture AbsorptionIPC-650 2.6.2.1%0.03%0.03
Flexural Strength (MD)IPC-650 2.4.4psi10,000N/mm269
Flexural Strength (CD)IPC-650 2.4.4psi9,000N/mm262
Tensile Strength (MD)IPC-650 2.4.19psi9,000N/mm262
Tensile Strength (CD)IPC-650 2.4.19psi7,000N/mm248
Young’s Modulus (MD)ASTM D 3039/IPC-TM-650 2.4.19kpsi721N/mm24971
Poisson’s Ratio (MD)ASTM D 3039/IPC-TM-650 2.4.190.1550.155
Peel Strength (1 oz. ED)IPC-650 2.4.8lbs/in8N/mm1.43
Thermal Conductivity (Unclad)IPC-650 2.4.50W/M*K0.9W/M*K0.9
Thermal Conductivity (CH/CH)IPC-650 2.4.50W/M*K1W/M*K1
Thermal Conductivity (C1/C1)IPC-650 2.4.50W/M*K1.05W/M*K1.05
Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.01mm/M0.01
Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.4 (After Bake)mils/in0.69mm/M0.69
Dimensional Stability (MD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.06mm/M0.06
Dimensional Stability (CD)IPC-650 2.4.39 Sec. 5.5 (Thermal Stress)mils/in0.8mm/M0.8
Surface ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm1.0 x 108Mohm1.0 x 108
Volume ResistivityIPC-650 2.5.17.1 (After Humidity)Mohm/cm1.0 x 108Mohm/cm1.0 x 108
CTE (X, Y axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C9.9ppm/°C9.9
CTE (Z axis)IPC-650 2.4.41 (RT- 150 °C)ppm/°C40ppm/°C40
Density (Specific Gravity)IPC-650 2.3.5g/cm32.84g/cm32.84
Specific HeatIPC-650 2.4.50J/gK0.94J/gK0.94
Td (2% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F930°C500
Td (5% Wt. Loss)IPC - 650 2.4.24.6 / TGA°F960°C515
Flammability RatingUL 94V-0V-0


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