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| Categories | Taconic PCB | 
|---|---|
| Brand Name: | Bicheng | 
| Model Number: | BIC-166.V1.0 | 
| Certification: | UL, ISO9001, IATF16949 | 
| Place of Origin: | CHINA | 
| MOQ: | 1PCS | 
| Payment Terms: | T/T | 
| Supply Ability: | 5000PCS per month | 
| Delivery Time: | 8-9 working days | 
| Packaging Details: | Vacuum bags+Cartons | 
| Base material: | PTFE based, ceramic filled fiberglass | 
| Layer count: | Double Layer, Multilayer, Hybrid PCB | 
| PCB thmil (0.762mm), 60mil (1.524mm)ickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30 | 
| PCB size: | ≤400mm X 500mm | 
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | 
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) | 
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. | 
| Company Info. | 
| Bicheng Electronics Technology Co., Ltd | 
| Verified Supplier | 
| View Contact Details | 
| Product List | 
RF PCB Built on 6.15 DK RF-60TC 10mil, 20mil, 30mil and 60mil Coating with Immersion Gold, Tin, HASL and OSP for Miniaturized Antenna
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RF-60TC is a ceramic-filled PolyTetraFluoride(PTFE) based (fiberglass substrate for the PCB of high power RF and microwave applications. It is designed to provide lower operating temperature in high power applications and the 6.15DK market. By improving dielectric heat dissipation and exceptionally lower dielectric losses, a better gain and efficiency are got in miniaturized antenna applications
RF-60TC's enhanced heat transfer function allows additional design margin to extend the life of active components and improve long-term reliability.
RF-60TC with extremely low profile and reverse treated copper is excellent to reduce insertion loss. Heavy metal based laminate is also available. RF-60TC’s low CTE and improved dimensional stability make it possible to build multi-layer PCB with improved PTH reliability.
Our PCB Capability (RF-60TC)
| PCB Material: | PTFE based, ceramic filled fiberglass | 
| Designation: | RF-60TC | 
| Dielectric constant: | 6.15 | 
| Layer count: | Double Layer, Multilayer, Hybrid PCB | 
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) | 
| PCB thickness: | 10mil (0.254mm); 20mil (0.508mm), 25mil(0.635mm); 30mil (0.762mm), 60mil (1.524mm) | 
| PCB size: | ≤400mm X 500mm | 
| Solder mask: | Green, Black, Blue, Yellow, Red etc. | 
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc.. | 
Benefits:
Maximized Signal Integrity: Features an improved loss tangent and a stable DK to minimize signal loss and boost antenna gain across a wide range of frequencies and operating temperatures.
Effective Heat Dissipation: High thermal conductivity manages heat effectively, allowing for higher power handling, cooler component operation, and enhanced product longevity.
Proven Structural Reliability: Exceptional dimensional stability and a low Z-axis CTE ensure robust performance in multilayer applications, providing reliable plated through-holes (PTHs) even under thermal stress.
Superior Copper Bonding: Offers excellent adhesion to metal, enabling the use of lower profile copper for fine-line patterning and heavy metal backs for thermal or structural support.
Resistant to Environmental Factors: Low moisture absorption maintains stable performance in humid conditions.



Applications:
High power amplifier
Miniaturized antennas (GPS / PATCH / RFID Reader)
Filters, couplers, dividers
Satellites
Typical Value of RF-60TC
| RF-60TC Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value | 
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 6.15 ± 0.15 | 6.15 ± 0.15 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 (Modified) | 0.002 | 0.002 | ||
| TcK | ppm/°C | -3.581 | ppm/°C | -3.581 | |
| Dielectric Breakdown | IPC-650 2.5.6 | kV | 55 | kV | 55 | 
| Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 550 | V/mm | 21,654 | 
| Arc Resistance | IPC-650 2.5.1 | Seconds | >180 | Seconds | >180 | 
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 | 
| Flexural Strength (MD) | IPC-650 2.4.4 | psi | 10,000 | N/mm2 | 69 | 
| Flexural Strength (CD) | IPC-650 2.4.4 | psi | 9,000 | N/mm2 | 62 | 
| Tensile Strength (MD) | IPC-650 2.4.19 | psi | 9,000 | N/mm2 | 62 | 
| Tensile Strength (CD) | IPC-650 2.4.19 | psi | 7,000 | N/mm2 | 48 | 
| Young’s Modulus (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | kpsi | 721 | N/mm2 | 4971 | 
| Poisson’s Ratio (MD) | ASTM D 3039/IPC-TM-650 2.4.19 | 0.155 | 0.155 | ||
| Peel Strength (1 oz. ED) | IPC-650 2.4.8 | lbs/in | 8 | N/mm | 1.43 | 
| Thermal Conductivity (Unclad) | IPC-650 2.4.50 | W/M*K | 0.9 | W/M*K | 0.9 | 
| Thermal Conductivity (CH/CH) | IPC-650 2.4.50 | W/M*K | 1 | W/M*K | 1 | 
| Thermal Conductivity (C1/C1) | IPC-650 2.4.50 | W/M*K | 1.05 | W/M*K | 1.05 | 
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.01 | mm/M | 0.01 | 
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.4 (After Bake) | mils/in | 0.69 | mm/M | 0.69 | 
| Dimensional Stability (MD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.06 | mm/M | 0.06 | 
| Dimensional Stability (CD) | IPC-650 2.4.39 Sec. 5.5 (Thermal Stress) | mils/in | 0.8 | mm/M | 0.8 | 
| Surface Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 | 
| Volume Resistivity | IPC-650 2.5.17.1 (After Humidity) | Mohm/cm | 1.0 x 108 | Mohm/cm | 1.0 x 108 | 
| CTE (X, Y axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 9.9 | ppm/°C | 9.9 | 
| CTE (Z axis) | IPC-650 2.4.41 (RT- 150 °C) | ppm/°C | 40 | ppm/°C | 40 | 
| Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 2.84 | g/cm3 | 2.84 | 
| Specific Heat | IPC-650 2.4.50 | J/gK | 0.94 | J/gK | 0.94 | 
| Td (2% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 930 | °C | 500 | 
| Td (5% Wt. Loss) | IPC - 650 2.4.24.6 / TGA | °F | 960 | °C | 515 | 
| Flammability Rating | UL 94 | V-0 | V-0 | ||

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