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IC Packaging Customized Outline JEDEC Matrix Trays ESD 7.62mm Flatness

Categories JEDEC Matrix Trays
Brand Name: Hiner-pack
Model Number: HN21075
Certification: ISO 9001 ROHS SGS
Place of Origin: Made In China
MOQ: 1000 pcs
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day
Delivery Time: 5~8 working days
Packaging Details: 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm
Material: PPO
Color: Black
Temperature: 150°C
Property: ESD
Surface resistance: 1.0x10E4~1.0x10E11Ω
Flatness: less than 0.76mm
Use: Transport,Storage,Packing
HS Code: 39239000
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IC Packaging Customized Outline JEDEC Matrix Trays ESD 7.62mm Flatness

Customized JEDEC Outline Matrix Trays for IC Packaging ESD 7.62mm Flatness

Our company will select JEDEC outline matrix trays for your IC and ensure compatibility with standardized semiconductor automation processes, test equipment and process tools. Not only that, we can also choose a different tray profile to better suit your process and equipment. Either way, you'll get professional advice and support. JEDEC tray are ideal for transportation and storage of ic chip because they are stackable, secure,. Most IC matrix trays are device-specific, with details optimized for the exact shape, size, and terminal style of the IC package.Although the packaging of BGA, CGA and PGA has many similarities, they all have different pallets. We know how to make a great tray.


1.Details about The HN21075 JEDEC Matrix Tray

All JEDEC matrix trays are 12.7*5.35inch(322.6*135.9mm) and are suitable for a variety of chip packages, including BGA.CSP.QFP.QFN and so on.Our company's professional team offers custom IC matrix trays in JEDEC outlines , and with short lead times. For high volumes and special tray outlines, a custom molded tray may be the best option for your integrated circuits, MEMS, or multichip modules. We help you choose the right tray for your ic packaging.

Outline Size322.6*135.9*7.62mmBrandHiner-pack
ModelHN21076Package TypeN/A
Cavity Size51.45*35.45*3.29mmMatrix QTY3*5=15PCS
MaterialPPOFlatnessMAX 0.1mm
ColorBlack(can be customized)ServiceAccept OEM,ODM
Resistance1.0x10e4-1.0x10e11ΩCertificateROHS SGS

2.Product Application

Embedded System Display technology

Micro and Nano systems Sensor Test and Measurement Techology
Electromechanical equipment and systems Power supply


Reference to temperature resistance of different materials

MaterialBake TemperatureSurface Resistance
PPEBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon PowderBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass FiberBake 125°C~Max 150°C1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon FiberMax 180°C1.0*10E4Ω~1.0*10E11Ω
IDP Color85°C1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

.FAQ

1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?

Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

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