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| Categories | Prototype PCB Board | 
|---|---|
| Brand Name: | ABIS | 
| Model Number: | ABIS 00011 | 
| Certification: | UL | 
| Place of Origin: | SHEN ZHEN CHINA | 
| MOQ: | 1 | 
| Price: | 0.1-0.8 | 
| Payment Terms: | L/C, D/A, D/P, T/T, Western Union, MoneyGram | 
| Supply Ability: | 5000000 | 
| Delivery Time: | 5-8 working day | 
| Packaging Details: | vacuum package | 
| Board thickness: | 1.6mm,0.2-7.0mm(≤0.2mm needs review) | 
| Base material: | FR-4,Aluminum base | 
| Surface finishing: | HASL,OSP,ENIG | 
| Min. line spacing: | 0.003",0.15mm | 
| Min. line width: | 3mil,0.15mm,0.05 mm | 
| Copper thickness: | 1oz,1/2OZ 1OZ 2OZ 3OZ | 
| Min. hole size: | 0.25mm,0.1mm | 
| Application: | Consumer Electronics,Electronics Device,Electrice Vehicle | 
| Material: | FR4 CEM1 CEM3 Hight TG | 
| Product name: | Pcb Board Assembly,Printed Circuit Board | 
| Solder mask color: | Green Black Red,Blue.green.red.black.white.etc | 
| Solder mask: | Green | 
| Type: | Electronic Board | 
| Item: | Custom Circuit Board | 
| Usage: | OEM Electronics | 
| Name: | PCB Board Production | 
| Number of layers: | 1-40 ( ≥30 layers needs review ) | 
| Company Info. | 
| Abis Circuits Co., Ltd. | 
| View Contact Details | 
| Product List | 
 ABIS CIRCUITS CO., LTD
 
 Created in 2006,as a long history China based PCB supplier, ABIS manufactures different kinds of printed circuit boards, including MCPCB,CEM-1,CEM-3,and FR4,FR-4 high Tg, Rogers, Teflon, Arlon ets special material.
 ABIS has set up two PCB factories in China: one for MCPCB producing, quick turn and small volumn making, and another for mass production. Currently, ABIS modern plants occupy total 10000 s.q.m facility, with more than 1100 stable and experienced workers. Professionalism and continuous optimization of manufacturing processes have positioned ABIS as a reliable and favorite partner for global companies.
  
| 
 Items | 
 Single/Double-sidedBoard/MutilayerBoard/FPC(1-24Layer) | ||
| 
 BaseMaterials | 
 FR-4(HighTG150*-170^),FR1.Aluminum,CEM-3,BT,94V0 | ||
| 
 Finishcopperthickness | 
 Outer6OZ,nner40Z | ||
| 
 Surfacefinish | 
 ENIG,ImAg.ImSn,0SP,HASL,Platinggold | ||
| 
 FinishedBoardSize | 
 MaxDouble-sidedBoard | 
 640mmX1100mm | |
| 
 MaxMutilayerBoard | 
 640mmX1100mm | ||
| 
 FinishedBoardHoleSize(PTHHole) | 
 MinFinishedBoardHoleSize | 
 0.15mm | |
| 
 ConductorWidthandSpacing | 
 MinConductorWidh | 
 0.01mm | |
| 
 MinConductorSpacing | 
 0.01mm | ||
| 
 ThicknessofPlatingandCoatingLayer | 
 PTHwallCopperThickness | 
 >0.02mm | |
| 
 TinSolderThickness(HotAlrLeveling) | 
 >0.02mm | ||
| 
 Nickl/GoldThickness | 
 Forcustomerspecialneed | ||
| 
 NicklPlatingLayer | 
 >2um | ||
| 
 GoldPlatingLayer | 
 >0.3um | ||
| 
 BareBoardTest | 
 SinglesideTest | 
 MaxTestPoint | 
 20480 | 
| 
 MaxBoardTestSize | 
 400mmx300mm | ||
| 
 DoubleSldeTest | 
 MaxTestPoint | 
 40960(GeneralUse) | |
| 
 4096(SpecialUse) | |||
| 
 MaxBoardTestSize | 
 406mmx325mm | ||
| 
 320mmx400mm | |||
| 
 MinTestpitchofSMT | 
 0.5mm | ||
| 
 TestVoltage | 
 10-250V | ||
| 
 MechanicalProcess | 
 Chamfer | 
 20*,30*,45*,60* | |
| 
 AngleTolerance | 
 
 | ||
| 
 DeepnessTolerance | 
 士0.20mm | ||
| 
 V.CutAngle | 
 20",30*,45* | ||
| 
 BoardThickness | 
 0.1-3.2mm | ||
| 
 ResiduesThickness | 
 :0.025mm | ||
| 
 CellParapositionPrecision | 
 士0.025mm | ||
| 
 ToleranceofOut-shapeProcess | 
 土0.1mm | ||
| 
 BoardWarp | 
 MaxValue | 
 0.7% | |
| 
 Optical Plotting | 
 MaxPlottingArea | 
 66mmX558.8mm | |
Q/TLead Time
| 
 Category | 
 Quickest Lead Time | 
 Normal Lead Time | 
| 
 Double sides | 
 24hrs | 
 120hrs | 
| 
 4 layers | 
 48hrs | 
 172hrs | 
| 
 6 layers | 
 z2hrs | 
 192hrs | 
| 
 8 layers | 
 96hrs | 
 212hrs 
 268hrs | 
| 
 10 layers | 
 120hrs | |
| 
 12 layers | 
 120hrs | 
 280hrs | 
| 
 14 layers | 
 144hrs | 
 292hrs | 
| 
 16-20 layers | 
 Depends on the specific requirements | |
| 
 Above 20 layers | 
 Depends on the specific requirements | |



On time delivery rate is more than 95%
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