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| Categories | Fr4 PCB | 
|---|---|
| Brand Name: | XCE | 
| Model Number: | XCEM | 
| Certification: | CE,ROHS, FCC,ISO9008,SGS,UL | 
| Place of Origin: | China | 
| MOQ: | 1pcs | 
| Price: | negotiation | 
| Payment Terms: | T/T,Western union | 
| Supply Ability: | 1, 000, 000 PCS / week | 
| Delivery Time: | 5-10 days | 
| Packaging Details: | inner: vacuum-packed bubble bag outer: carton box | 
| Material: | FR4 | 
| Layer: | 2 | 
| Color: | Green | 
| Min line space: | 4mil | 
| Min line width: | 4mil | 
| Copper thickness: | 1OZ | 
| Board size: | 100*55MM | 
| Panel: | 1 | 
| Surface: | HASL-LF | 
2 Layers Rigid Copper PCB for Switch, Electronics Component FM Modulator Circuit
We are a profesional FR4 PCB Circuit Board manufacturer in China, and we can offer a various of single sided
to multilayer PCB to you.
F (for flame) and R (for retardancies) and the 4 is a 4 epoxy.FR4
is a glass fiber epoxy laminate.FR4 is the Main material for PCB
manufacture, it is the excellent quality and reasonable price
material
FR-4 is widely used for single and multilayer boards, which has
excellent thermal tolerance as much as 130°C. Now this type
material FR-4 is more widely manufactured, but the hence is less
costly.
Features:
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric
tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability
specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including
lamination.imersion Gold),we make 1~24layers board in guaranteed
quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness
0.2~7.0mm,copper thickness 1/3~8oz are available )
Parameter:
| Product name | FR4 PCB | Double side | 4 layer | 6 layer | 8 layer | 10-28layer | 
| layer | Single side | Double side | 4 layer | 6 layer | 8 layer | 10-28layer | 
| Base Maerial | FR4 | FR4,Alu,polymide | FR4 | FR4 | FR4 | FR4 | 
| Copper thickness | 1-6OZ | |||||
| Min.Hole size | 0.1mm | |||||
| Min.Line Width | 0.1mm | |||||
| Surface finishing: | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating | |||||
| Solder masker color | green,red,black,white,yellow | |||||
| Silkscreen color | black,white,yellow | |||||
| Tolerance | - Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05 | |||||
| Special requirements | Buried and blind vias+controlled impedance +BGA | |||||
| Total Pad Size | Standard | Advanced | 
| Capture Pad | Drill + 0.008 | Drill + 0.006 | 
| Landing Pad | Drill + 0.008 | Drill + 0.006 | 
| BC Mechanical Drill (Type III) | 0.008 | 0.006 | 
| Laser Drill Size | 0.004-0.010 | 0.0025 | 
| Material Thickness | 0.0035 | 0.0025 | 
| Stacked Via | Yes | Yes | 
| Type I Capabilities single & Double Deep | Yes | Yes | 
| Type II Capabilities Buried Vias with Microvias | Yes | Yes | 
| Type III Capabilities | Yes | Yes | 
| Copper Filled Microvia | Yes | Yes | 
| Smallest Copper Filled Microvia | 0.004 | 0.0025 | 
| Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:01 | 
| Smallest Laser Microvia Hole Size | 0.004 | 0.0025 | 
| Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:01 | 
|   | 
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