| Sign In | Join Free | My insurersguide.com |
|
| Categories | Rogers PCB |
|---|---|
| Brand Name: | XCE |
| Model Number: | XCEM |
| Certification: | CE,ROHS, FCC,ISO9008,SGS,UL |
| Place of Origin: | China |
| MOQ: | 1pcs |
| Price: | negotiation |
| Payment Terms: | T/T,Western union |
| Supply Ability: | 1, 000, 000 PCS / week |
| Delivery Time: | 5-10 days |
| Packaging Details: | inner: vacuum-packed bubble bag outer: carton box |
| Material: | Rogers |
| Layer: | 4 |
| Min line space: | 5mil |
| Min line width: | 5mil |
| Copper thickness: | 1OZ |
| Board size: | 55*55MM |
| Panel: | 1 |
Xinchenger Electronics co.,Ltd established in 2002,
we have commited ourselves to manufacturing various of hi-frequency microwave pcb
and multi-layer board including fastest sample production.
Key Specifications/Special Features:
Keyword: Rogers PCB supplier, high frequency PCBs manufacturer from XCE
Layers: multi-layer
Board thicknesses: 0.8mm
Board thickness tolerance: around 5%
Minimum hole size: 0.2mm
Minimum track width/space: 0.075/0.075mm
Solder mask thickness: 0.01mm
Material: Rogers,F4B,Taconic,Isola,Teflon
Layer no: 1-16
Finished board thickness: 0.2 mm-3.5mm (8mil-138mil)
Board thickness tolerance: ±10%
Cooper thickness: 0.5oz-4oz (18um-144um)
Copper plating hole: 18-30um
Impedance control: ±10%
Warp and twist: 0.70%
Image:
Minimum trace width (a) 0.075mm (3 mil)
Minimum space width (b) 0.075mm (3 mil)
SMD pitch (a) 0.2mm (8 mil)
BGA pitch (b) 0.2mm (8 mil)
Solder mask:
Minimum solder mask dam (a) 0.0635 mm (2.5mil)
Soldermask Clearance (b)0.075mm (3 mil)
Minimum SMT pad spacing (c) 0.075mm (3 mil)
Solder mask thickness 0.0007"(0.018mm)
Holes:
Minimum hole size (CNC): 0.2mm (8 mil)
Minimum punch hole size: 0.9mm (35 mil)
Hole size: Tol(+/-)PTH: ±0.075m, NPTH: ±0.05mm
Hole position: Tol ±0.075mm
Plating:
HASL/lead free HASL: 2.5um
Immersion gold nickel: 3-7umAu:1-5u"
OSP: 0.2-0.5um
Certifications: RoHS, ISO 9001, SGS, UL
| Item | Mass Production | Pilot Run Production |
| Capacity | Capacity | |
| Layer Counts | 1L—18L, HDI | 20-28 , HDI |
| Material | High Frequency | |
| Teflon,PTFE(F4B,F4BK), Rogers(4003,4350,5880,3003)Taconic(TLX-8,TLX-9), Arlon(35N,85N)etc. | ||
| Material Mixed Laminate | 4 layers -- 10 layers | 12 layers |
| FR4+Rogers | ||
| Maximum Size | 610mm X 1200mm | |
| Board Outline Tolerance | ±0.15mm | ±0.10mm |
| Board Thickness | 0.125mm--6.00mm | 0.1mm--8.00mm |
| Thickness Tolerance ( t≥0.8mm) | ± 8% | ±5% |
| Thickness Tolerance( t<0.8mm) | ±10% | ±8% |
| Minimum Line / Space | 0.10mm | 0.075mm |
| Trace width Tolerance | 15%-20% | 10% |
| Minimum Drilling Hole (Mechanical) | 0.2mm | 0.15mm |
| Minimum laser hole | 0.1mm | 0.075mm |
| Hole Position/hole Tolerance | ±0.05mm PTH:±0.076MM NPTH:±0.05mm | |
| Mini hole ring (single | 0.075MM | 0.05MM |
| OutLayer Copper Thickness | 17um--175um | 175um--210um |
| InnerLayer Copper Thickness | 17um--175um | 175um--210um |
| Mini Solder Mask Bridge | 0.05mm | 0.025mm |
| Impedance Control Tolerance | ±10% | ±5% |
| Surface Finishing | HASL, Lead free HASL, Immersion gold, Immersion tin, Immersion Silver. | |
| Plated gold , OSP, Carbon ink, | ||
| 1-2L Lead-time | 3-7 days | 1-2 days |
| 4- 8L Lead-time | 7-10 days | 2-7 days |
| 10-18L Lead-time | 10-15 days | 4-9 days |
| 20-28L Lead-time | 15-20 days | |
| Acceptable File Format | ALL Gerber Files,POWERPCB,PROTEL,PADS2000,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 etc. | |
| Quality Standards | IPC-A-600F and MIL-STD-105D CHINA GB<4588> | |
|