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| Categories | SMT PCB Assembly | 
|---|---|
| Brand Name: | OEM and ODM | 
| Model Number: | SL81023S006 | 
| Certification: | UL,RoHS, CE | 
| Place of Origin: | China | 
| MOQ: | 1pc | 
| Price: | Negotiable | 
| Payment Terms: | T/T, Western Union, MoneyGram,Paypal | 
| Supply Ability: | 100000pcs per day | 
| Delivery Time: | 5-7 days | 
| Packaging Details: | ESD package | 
| Type: | PCBA Prototype | 
| Components: | Qualified | 
| SMT: | Support | 
| Features 1: | Gerber/PCB file needed | 
| Features 2: | 100% E-test | 
| Features 3: | Quality 2 years guarantee | 
SMT Components Multilayer PCB Assembly Prototype Printed Circuit
Board
LEAD TIME FOR PRODUCTION ORDERS
| Sample Lead time | Mass production lead time | |
| Single sided PCB | 1~3 | 4~7 | 
| Double sided PCB | 2~5 | 7~10 | 
| Multilayer PCB | 7~8 | 10~15 | 
| PCB and Assembly | 8~15 | 15~20 | 
Features
1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service
is available
PCB Assembly Capability
| Stencil Size | 736x736mm | 
| Minimum IC Pitch | 0.2mm | 
| Maximum PCB size | 1200x 500mm | 
| Minimum PCB thickness | 0.25mm | 
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) | 
| Maximum BGA size: | 74x74mm | 
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) | 
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) | 
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) | 
| Volume: | One piece to low volume production quantities | 
| Assembly type: | Surface mount(SMT) assembly | 
| Components type: | Passive components: | 
| Parts procurements: | Turnkey(we supply the parts) | 
| Solder type: | Leaded | 
| Other capabilities: | Repair/rework services | 
PCBA Picture
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