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| Categories | Through Hole PCB Assembly |
|---|---|
| Brand Name: | HUASWIN |
| Model Number: | HSPCBA1616 |
| Certification: | ISO/UL/RoHS |
| Place of Origin: | China |
| MOQ: | 1 sets |
| Price: | Negotiation |
| Payment Terms: | T/T, Western Union, L/C |
| Supply Ability: | 10,000pcs per month |
| Delivery Time: | 15-20 working days |
| Packaging Details: | Anti-static bag + Anti-static bubble wrap + Good quality carton box |
| Company Info. |
| Huaswin Electronics Co.,Limited |
| View Contact Details |
| Product List |
USB 2 layer PCB Assembly with Customized SMT Through Hole
Specifications:
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based
material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP
surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610
Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
Detailed Specification of PCB Manufacturing
1 | layer | 1-30 layer |
2 | Material | CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
3 | Board thickness | 0.2mm-6mm |
4 | Max.finished board size | 800*508mm |
5 | Min.drilled hole size | 0.25mm |
6 | min.line width | 0.075mm(3mil) |
7 | min.line spacing | 0.075mm(3mil) |
8 | Surface finish | HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing,Plastic bag |
12 | Outer packing | standard carton packing |
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
14 | Certificate | UL,ISO9001,ISO14001,ROHS,TS16949 |
15 | Profiling punching | Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
1 | Type of Assembly | SMT and Thru-hole |
2 | Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
3 | Components | Passives Down to 0201 Size |
BGA and VFBGA | ||
Leadless Chip Carries/CSP | ||
Double-Sided SMT Assembly | ||
Fine Pitch to 08 Mils | ||
BGA Repair and Reball | ||
Part Removal and Replacement-Same Day Service | ||
3 | Bare Board Size | Smallest:0.25x0.25 Inches |
Largest:20x20 Inches | ||
4 | File Formats | Bill of Materials |
Gerber Files | ||
Pick-N-Place File(XYRS) | ||
5 | Type of Service | Turn-Key,Partial Turn-Key or Consignment |
6 | Component Packaging | Cut Tape |
Tube | ||
Reels | ||
Loose Parts | ||
7 | Turn Time | 15 to 20 days |
8 | Testing | AOI inspection |
X-Ray inspection | ||
In-Circuit testing | ||
Functional test |
|
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