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All bga package system on chip wholesalers & bga package system on chip manufacturers come from members. We doesn't provide bga package system on chip products or service, please contact them directly and verify their companies info carefully.
| Total 58 products from bga package system on chip Manufactures & Suppliers |
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Brand Name:Original Factory Model Number:S28HS01GTGZBHI030 Place of Origin:CN Integrated Circuit Chip S28HS01GTGZBHI030 BGA Package 1024MBit Memory Chips Product Description Of S28HS01GTGZBHI030 S28HS01GTGZBHI030 is 1024MBit, 400MByte/s, Industrial Memory Chip. Specification Of S28HS01GTGZBHI030 Part Number S28HS01GTGZBHI030 ... |
ShenZhen Mingjiada Electronics Co.,Ltd.
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Brand Name:XILINX / AMD Model Number:XC6SLX150-2FGG676I Place of Origin:original ...Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package... |
Shenzhen Sai Collie Technology Co., Ltd.
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Categories:BGA Assembly Country/Region:china ...BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection ♦ What is BGA Assembly? BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip is soldered directly to the PCB by means of an "array of miniature solder balls", like "planting" tiny solder balls on the bottom of the chip to achieve ultra-fine electrical connections.BGA... |
DQS Electronic Co., Limited
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Brand Name:BROADCOM Place of Origin:China Model Number:BCM56567B0KFSBG ... in a wide range of applications. It features high-performance gate array IC design, programming cycles from 100 to 10000, and a variety of packages including QFP, BGA, and more. This chip is capable of |
STJK(HK) ELECTRONICS CO.,LIMITED
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Model Number:G2864TLCB/G28128TLCB/G28256TLCB/G2564LTCB/G25128LTCB/G25256LTCB Brand Name:PG Place of Origin:Shenzhen, China Industrial eMMC 5.1 BGA 153 Ball Embedded Chips Industrial-grade eMMC 5.1 embedded chips featuring BGA 153-ball packaging with capacities of 64GB, 128GB, and 256GB. These high-reliability, high-performance storage solutions are specifically engineered for ... |
China Chips Star Semiconductor Co., Ltd.
Guangdong |
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Brand Name:UNICOMP Model Number:AX9500 Place of Origin:China ... PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone ... |
Unicomp Technology
Guangdong |
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Place of Origin:Malaysia Brand Name:N/A Model Number:MPC8260AZUPIBB MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit Speed ... |
Mega Source Elec.Limited
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Brand Name:Hiner-pack Model Number:HN23111 Place of Origin:SHENZHEN CN Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design Product Description: JEDEC Trays: The Safest Way to Handle and Transport Semiconductor Devices When it comes to semiconductor devices such as integrated circuits (ICs), safe ... |
Shenzhen Hiner Technology Co., Ltd.
Guangdong |
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Brand Name:Qualcomm Model Number:CSR8645B04-IBBC-R Place of Origin:USA CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product ... |
QIN XIN (HONG KONG) ELECTRONIC TECHNOLOGY CO.,LIMITED
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Brand Name:Jiaqing Circuit Place of Origin:China BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture ... |
Shenzhen Jiaqing Circuit Co., Ltd.
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Brand Name:C2MICRO TI Model Number:CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Place of Origin:Malaysia Electronic components Integrated Circuits (ICs) CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR C2MICRO TI BGA VQFN48 VQFN32 IC Integrated Circuits Components Specification :CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Category Integrated Circuits (... |
HK NeoChip Technology Limited
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Brand Name:C2MICRO TI Model Number:CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Place of Origin:Malaysia Electronic components Integrated Circuits (ICs) CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR C2MICRO TI BGA VQFN48 VQFN32 IC Integrated Circuits Components Specification :CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Category Integrated Circuits (... |
Angel Technology Electronics Co
Hongkong |
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Model Number:XC7Z100-2FFG900I XC7Z100-2FFG900I Bga900 Embedded Communication Chip XC7Z100-2FFG900I XC7Z100-FFG900 XC7Z100-2FFG900 XC7Z100 FBGA900 IC Our goods: Active components (IC integrated circuits, memory chips, diodes, transistors, etc.) Passive components (capacitors, resistors... |
LU'S TECHNOLOGY CO., Ltd.
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Brand Name:QUALCOMM Model Number:IPQ4019-0vv Place of Origin:AMERICA
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G-Resource Electronics Co.,Ltd
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Brand Name:Shinelink Model Number:SL0925S01 Place of Origin:China ...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the |
Shenzhen Shinelink Technology Ltd
Guangdong |
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Brand Name:HSTECH Model Number:HS-700 Place of Origin:China ... of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of |
Shenzhen Hansome Technology Co., Ltd.
Guangdong |
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Brand Name:XILIN Model Number:XQR17V16CC44V ...: programmable ic chips , integrated circuit chips XQR17V16CC44V Specification.pdf Part number:XQR17V16CC44V Stock Quantity:1000pcs Specifications for XQR17V16CC44V: Mfr Package Description CERAMIC, LCC-44 Package Equivalence Code LDCC44,.7SQ Number of |
SHENZHEN ECER NETWORK TECHNOLOGY CO.,LTD
Guangdong |
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Model Number:LMV358IDR Place of Origin:original factory Stock Offer (Hot Sell) Part No. Quantity Brand D/C Package MT29F8G08ADADAH4-IT:D 2972 MICRON 14+ BGA MT41J128M16HA-15E:D 2272 MICRON 13+ BGA MT41K256M16HA-125:E 8138 MICRON 15+ BGA MT46H32M16LFBF-6IT:C 3135 MICRON 12+ BGA MT46H64M16LFBF-5IT 2231 MICRON 14... |
ChongMing Group (HK) Int'l Co., Ltd
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Brand Name:GCT Model Number:GDM7243SB10CGT Place of Origin:Original Manufacturer ...BGA COMPUTER IC CHIPS ORIGINAL NEW CONDITION 365 DAYS WARRANTY Detailed Product Description Commdity: GDM7243SB10CGT Lead Time: 2-3 DAYS Package: Standard Packaging Warranty: 365 Days Shipping Ways: China Post/DHL/FEDEX/UPS/TNT/DPEX/KAS Payment Ways: TT / Escrow 10(we Pay Hkinventory Escrow Fee) / Paypal / Western Union High Light: computer integrated circuits , integrated circuit chips... |
Shenzhen Huahao Gaosheng Technology Co., Ltd
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