bga package system on chip

Brand Name:Original Factory

Model Number:S28HS01GTGZBHI030

Place of Origin:CN

Integrated Circuit Chip S28HS01GTGZBHI030 BGA Package 1024MBit Memory Chips​ Product Description Of S28HS01GTGZBHI030 S28HS01GTGZBHI030 is 1024MBit, 400MByte/s, Industrial Memory Chip. Specification Of S28HS01GTGZBHI030 Part Number S28HS01GTGZBHI030 ...

Place of Origin:Guangdong, China

Brand Name:Original

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Brand Name:XILINX / AMD

Model Number:XC6SLX150-2FGG676I

Place of Origin:original

...Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature -40°C ~ 100°C (TJ) Package / Case 676-BGA Supplier Device Package...

Brand Name:BROADCOM

Place of Origin:China

Model Number:BCM56567B0KFSBG

... in a wide range of applications. It features high-performance gate array IC design, programming cycles from 100 to 10000, and a variety of packages including QFP, BGA, and more. This chip is capable of

Place of Origin:Malaysia

Brand Name:N/A

Model Number:MPC8260AZUPIBB

MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active Core Processor MSP430 Core Size 16-Bit Speed ...

Brand Name:XILINX

Model Number:XC7A200T-3SBG484E

Place of Origin:original

XC7A200T-3SBG484E BGA Components New Original Tested Integrated Circuit Chip IC XC7A200T-3SBG484E To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided. We attach ...

Brand Name:Qualcomm

Model Number:CSR8645B04-IBBC-R

Place of Origin:USA

CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute Manufacturer: Qualcomm RF360 Product ...

Brand Name:UNICOMP

Model Number:CX7000L

Place of Origin:China

Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic...

Brand Name:Mingseal

Model Number:FS600A

Place of Origin:China

Inline Dual-Track Visual Dispensing Machine for Chip Underfill The FS600 Series Inline Visual Dispensing Machine is an advanced high-efficiency dispensing solution engineered for chip underfill and electronic component assembly. Tailored to meet the ...

Brand Name:C2MICRO TI

Model Number:CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR

Place of Origin:Malaysia

Electronic components Integrated Circuits (ICs) CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR C2MICRO TI BGA VQFN48 VQFN32 IC Integrated Circuits Components Specification :CC1203F08SG7F-JHC1 CC1310F128RGZR CC1310F128RHBR Category Integrated Circuits (...

Model Number:XC7Z100-2FFG900I

XC7Z100-2FFG900I Bga900 Embedded Communication Chip XC7Z100-2FFG900I XC7Z100-FFG900 XC7Z100-2FFG900 XC7Z100 FBGA900 IC Our goods: Active components (IC integrated circuits, memory chips, diodes, transistors, etc.) Passive components (capacitors, resistors...

Brand Name:Hiner-pack

Model Number:HN23111

Place of Origin:SHENZHEN CN

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Brand Name:QUALCOMM

Model Number:IPQ4019-0vv

Place of Origin:AMERICA

Brand Name:Shinelink

Model Number:SL0925S01

Place of Origin:China

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside for SMT mounting. The whole bottom surface of the

Brand Name:XILIN

Model Number:XQR17V16CC44V

...: programmable ic chips , integrated circuit chips XQR17V16CC44V Specification.pdf Part number:XQR17V16CC44V Stock Quantity:1000pcs Specifications for XQR17V16CC44V: Mfr Package Description CERAMIC, LCC-44 Package Equivalence Code LDCC44,.7SQ Number of

Brand Name:HSTECH

Model Number:HS-700

Place of Origin:China

...BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA rework station its rework range includes a variety of package

Brand Name:ALTERA

Model Number:EP4CE15F23C8N

... V Supply Voltage - Max: 1.25 V Minimum Operating Temperature: 0 C Maximum Operating Temperature: + 85 C Mounting Style: SMD/SMT Package / Case: FBGA-484 Packaging: Tray Brand:

Brand Name:Anterwell

Model Number:LMV358IDR

Place of Origin:original factory

Stock Offer (Hot Sell) Part No. Quantity Brand D/C Package MT29F8G08ADADAH4-IT:D 2972 MICRON 14+ BGA MT41J128M16HA-15E:D 2272 MICRON 13+ BGA MT41K256M16HA-125:E 8138 MICRON 15+ BGA MT46H32M16LFBF-6IT:C 3135 MICRON 12+ BGA MT46H64M16LFBF-5IT 2231 MICRON 14...

Model Number:LMV358IDR

Place of Origin:original factory

Stock Offer (Hot Sell) Part No. Quantity Brand D/C Package MT29F8G08ADADAH4-IT:D 2972 MICRON 14+ BGA MT41J128M16HA-15E:D 2272 MICRON 13+ BGA MT41K256M16HA-125:E 8138 MICRON 15+ BGA MT46H32M16LFBF-6IT:C 3135 MICRON 12+ BGA MT46H64M16LFBF-5IT 2231 MICRON 14...