0 5 mm pitch bga

Brand Name:Loranger

Model Number:Ball Grid Array (BGA)/Chip Scale Package (CSP) Sockets

...mm Pitch and Greater Accommodates Package Height Variations Non-Magnetic Socket Options Available Accurate, Tightly-controlled Package Fit Contacts Connect Solder ball to Board Pad Optional Heat Sink Item # Item Name Package Name Number of Input/Output (I/O) Pitch 006004006J6617 6 Input/Output (I/O) and 0.23/0.22 Millimeter (mm) Pitch Ball Grid Array (BGA)/Chip Scale Package (CSP) Socket BGA/CSP 6 Multi0.22 mm0.23 mm...

Brand Name:HUASWIN

Model Number:HSPCBA1021

Place of Origin:China

... build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD workmanship ...

Brand Name:ABIS

Model Number:H-PCB2

Place of Origin:China

... BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.008 in. (0.2 mm) Max Parts size assembly by machine 2.2 in. x 2.2 in. x 0.6 in. ...

Brand Name:Hansion

Model Number:FR4 double side PCBA

...*50MM Component height: Top 120 mm/Bot 15 mm PTH Machine. Non-standard Surface Mount Technology (SMT) Machine Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double- Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and

Brand Name:JIETENG

Model Number:Rogers FR4

Place of Origin:Guangdong, China

...: 0.15mm/4mil PCB Test:: Flying probe and AOI (Default)/Fixture Test Chip and IC:: 0201(0.6*0.3)~22*22 BGA Pitch: 0.3 mm ~3.0 mm QFP Pitch: 0.3 mm ~1.0 mm Number of

Brand Name:HighLeap

Model Number:PCBA

Place of Origin:China

... pcb assembly prototype service Board Size Board machine SMT size 40*50 mm SMT+DIP Machine SMT and through-hole assembly BGA part Able to process 0.35 pitch micro BGA, AQFN, QFP, QFN, & AQFN (advanced quad flat no-leads) Quantity Up to 100,000 pieces...

Brand Name:China chao sheng

Model Number:cspcba1028

Place of Origin:Shenzhen, Guangdong, China

...,14-layer HDI+PCBA Fast prototyping High mix, low and medium volume build SMT MinChip:0201 BGA: 1.0 to 3.0 mm pitch Through-hole assembly Special processes (such as conformal coating and potting) ROHS capability IPC-A-610E and IPC/EIA-STD

Brand Name:Original Factory

Model Number:2034560003

Place of Origin:CN

... Height, BGA-Attach Mounting, 7 Pair, 11 Row, 699 Circuits, 0.76µm Gold (Au) Plating, without Pegs. Specification Of 2034560003 Part Number: 2034560003 Product: Connectors Number of Positions: 699 Position Pitch: 1.3 mm (0.051 in) Number of Rows: 11 Row