Sign In | Join Free | My insurersguide.com
insurersguide.com
Products
Search by Category
Home > PCB & PCBA >

Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security

Categories Multilayer PCB
Brand Name: XCE
Model Number: XCEM
Certification: CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin: China
MOQ: 1pcs
Price: negotiation
Payment Terms: T/T,Western union
Supply Ability: 1, 000, 000 PCS / week
Delivery Time: 5-10 days
Packaging Details: inner: vacuum-packed bubble bag outer: carton box
Material: FR4
Layer: 8
Color: Green
Min line space: 4mil
Min line width: 4mil
Copper thickness: 1OZ
Board size: 189*19mm
Panel: 1
Surface: ENIG
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security


    Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security


    8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB

    Key Specifications/Special Features:
    Key Specifications

    Number of layers: 8L
    Base-material: FR4, TG150
    Thickness: 1.8 mm+/-10%
    Final-Cu: 35um
    Impedance: No
    Blind and buried via: Yes
    Min. Drill hole: 0.25mm
    Min. Line space: 0.127mm
    Min. Line width: 0.127mm
    Mech. treatment: Routing
    Surface treatment: ENIG
    Solder-mask: Green
    Legend-Print: white
    100% E-test: Yes

    Reasonable price and professional services.
    UL,SGS,ISO9001,ISO14001,RoHS and ISO TS16949


    Main Export Markets:
    Asia
    Australasia
    Central/South America
    Eastern Europe
    Mid East/Africa
    North America
    Western Europe


    Specification:
    8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB
    Green Soldermask White Silkscreen,
    FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
    with electronic level glass fiber cloth as reinforcing material of substrate.
    Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
    in production of multilayer printed circuit board,
    This kind of product is mainly used for double-sided PCB, dosage is very large.
    Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
    in recent years because of the electronic product installation technology
    and PCB technology development needs, appeared high Tg FR - 4 products.


    Specification:

    8-Layer Electronics 3 Oz Copper Base Multilayer Rigid PCB Security Electronics PCB,

    FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder, with electronic level glass fiber cloth as reinforcing material of substrate. Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material in production of multilayer printed circuit board,This kind of product is mainly used for double-sided PCB, dosage is very large. Epoxy glass fiber cloth substrate, the most widely used model for FR - 4, in recent years because of the electronic product installation technology and PCB technology development needs, appeared high Tg FR - 4 products.


    Immersion Gold and the difference between gold-plated plate 1, immersion gold and gold-plated crystal structure is not the same as the thickness of gold for gold than gold-plated lot of gold will be gold-plated gold is more yellow, more satisfied customers. 2, immersion gold and gold-plated crystal structure is not the same, Shen Jin is easier than gold-plated welding, will not cause poor welding, causing customer complaints. Immersion gold plate of the stress more easily controlled, there is a bonding of products, more conducive to the processing of bonding. But also because of the gold than the gold-plated soft, so Shen Jin-board do not wear gold finger. 3, immersion gold plate only nickel gold pads, skin effect of the signal transmission is in the copper layer will not affect the signal. 4, immersion gold than gold-plated crystal structure is more compact, not easy to produce oxidation. 5, with the wiring more and more dense, line width, spacing has come to 3-4MIL. Gold is easy to produce gold short-circuit. Immersion gold plate only nickel gold on the pad, it will not produce gold short-circuit. 6, immersion gold plate only nickel gold on the pad, so the resistance of the line with the combination of copper layer is more solid. Engineering will not compensate for the spacing of the impact. 7, generally used for the relatively high requirements of the board, flatness is better, generally use immersion gold, immersion gold generally do not appear after the assembly of the black pad phenomenon. Immersion gold plate flatness and standby life as good as gold-plated plate


    Parameter:


    oItemData
    1Layer:1 to 24 layers
    2Material type:FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
    3Board thickness:0.20mm to 3.4mm
    4Copper thickness:0.5 OZ to 4 OZ
    5Copper thickness in hole:>25.0 um (>1mil)
    6Max. Board Size:(580mm×1200mm)
    7Min. Drilled Hole Size:4mil(0.1mm)
    8Min. Line Width:3mil (0.075mm)
    9Min. Line Spacing:3mil (0.075mm)
    10Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
    11Solder Mask Color:Green/Yellow/Black/White/Red/Blue
    12Shape tolerance:±0.13
    13Hole tolerance:PTH: ±0.076 NPTH: ±0.05
    14Package:Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
    15Certificate:UL,SGS,ISO 9001:2008
    16Special requirements:Buried and blind vias+controlled impedance +BGA
    17Profiling:Punching, Routing, V-CUT, Beveling


    Place of Origin:

    Guangdong China (Mainland)

    Brand Name:

    XCE

    Model Number:

    XCEPCB008

    Base Material:

    FR4

    Copper Thickness:

    0.3-3oz

    Board Thickness:

    0.3-6mm

    Min. Hole Size:

    0.2mm

    Min. Line Width:

    3mil

    Min. Line Spacing:

    3mil

    Surface Finishing:

    HASL, OSP, Immersion Gold/Au, Immersion silver, etc.

    Solder mask:
    Green
    PCB Standard:

    IPC-A-610 E Class II-III

    Wrap and twist:

    5%

    Layer Count:

    1-22

    profiling punching:

    Routing, V-CUT, Beveling

    Max board size:

    1200mm*600mm

    Hole tolerance:

    PTH:±0.075,NTPH:±0.05

    PCB Tolerance of finished thickness:

    ±5%

    PCB:

    Customized

    Product name:

    pcb

    Quality Electronics 3 Oz Copper Base Multilayer PCB , Rigid Custom Made Pcb Boards Security wholesale
    Send your message to this supplier
     
    *From:
    *To: Shenzhen Xinchenger Electronic Co.,Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0